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Atsushi Nagata

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  • Koshi City, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Bonding system and bonding method
    • Patent number 10,847,495
    • Issue date Nov 24, 2020
    • Tokyo Electron Limited
    • Atsushi Nagata
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    BONDING METHOD AND BONDING SYSTEM
    • Publication number 20240339431
    • Publication date Oct 10, 2024
    • TOKYO ELECTRON LIMITED
    • Kazutaka Noda
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDING SYSTEM AND BONDING METHOD
    • Publication number 20190312007
    • Publication date Oct 10, 2019
    • TOKYO ELECTRON LIMITED
    • Atsushi Nagata
    • H01 - BASIC ELECTRIC ELEMENTS