Atsushi NISHIKIZAWA

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 10,522,446
- Issue date Dec 31, 2019
- Renesas Electronics Corporation
- Atsushi Nishikizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and electronic device
- Patent number 10,157,878
- Issue date Dec 18, 2018
- Renesas Electronics Corporation
- Tadatoshi Danno
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and electronic device
- Patent number 9,735,127
- Issue date Aug 15, 2017
- Renesas Electronics Corporation
- Tadatoshi Danno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,530,721
- Issue date Dec 27, 2016
- Renesas Electronics Corporation
- Atsushi Nishikizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,994,159
- Issue date Mar 31, 2015
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,367,479
- Issue date Feb 5, 2013
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with the leads projected from sealing body
- Patent number 8,338,927
- Issue date Dec 25, 2012
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor connection component
- Patent number 8,298,859
- Issue date Oct 30, 2012
- Renesas Electronics Corporation
- Nobuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor integrated circuit device
- Patent number 8,026,130
- Issue date Sep 27, 2011
- Renesas Electronics Corporation
- Hiroyuki Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor connection component
- Patent number 7,968,370
- Issue date Jun 28, 2011
- Renesas Electronics Corporation
- Nobuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor connection component
- Patent number 7,462,887
- Issue date Dec 9, 2008
- Renesas Technology Corp.
- Nobuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bumper portions integral with a heat sink
- Patent number 6,492,739
- Issue date Dec 10, 2002
- Hitachi, Ltd.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having bumper portions integral with a heat sink
- Patent number 6,392,308
- Issue date May 21, 2002
- Hitachi, Ltd.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 6,320,270
- Issue date Nov 20, 2001
- Hitachi, Ltd.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of producing the same
- Patent number 6,104,085
- Issue date Aug 15, 2000
- Hitachi, Ltd.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a heat sink with bumpers for protecting...
- Patent number 5,808,359
- Issue date Sep 15, 1998
- Hitachi, Ltd.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20180151479
- Publication date May 31, 2018
- RENESAS ELECTRONICS CORPORATION
- Atsushi NISHIKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20170301643
- Publication date Oct 19, 2017
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi DANNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE
- Publication number 20170077069
- Publication date Mar 16, 2017
- RENESAS ELECTRONICS CORPORATION
- Tadatoshi DANNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160093557
- Publication date Mar 31, 2016
- Renesas Electronics Corporation
- Atsushi NISHIKIZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20130127032
- Publication date May 23, 2013
- RENESAS ELECTRONICS CORPORATION
- Hiroyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20110316137
- Publication date Dec 29, 2011
- RENESAS ELECTRONICS CORPORATION
- Hiroyuki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR CONNECTION COMPONENT
- Publication number 20110143500
- Publication date Jun 16, 2011
- RENESAS ELECTRONICS CORPORATION
- Nobuya KOIKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100258922
- Publication date Oct 14, 2010
- Renesas Technology Corp.
- Hiroyuki NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
- Publication number 20090317948
- Publication date Dec 24, 2009
- Renesas Technology Corp.
- Hiroyuki NAKAMURA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR CONNECTION COMPONENT
- Publication number 20090068796
- Publication date Mar 12, 2009
- RENESAS TECHNOLOGY CORP.
- Nobuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20070040187
- Publication date Feb 22, 2007
- Nobuya Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20020096791
- Publication date Jul 25, 2002
- Hitachi, Ltd.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of producing the same
- Publication number 20010006259
- Publication date Jul 5, 2001
- Hitachi, Ltd.
- Kuniharu Muto
- H01 - BASIC ELECTRIC ELEMENTS

Atsushi NISHIKIZAWA

Person

Patents Grantslast 30 patents

Semiconductor device and manufacturing method of the same

Semiconductor device and electronic device

Semiconductor device and electronic device

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor device with the leads projected from sealing body

Semiconductor connection component

Method for manufacturing a semiconductor integrated circuit device

Semiconductor connection component

Semiconductor connection component

Semiconductor device having bumper portions integral with a heat sink

Semiconductor device having bumper portions integral with a heat sink

Semiconductor device and method of producing the same

Semiconductor device and method of producing the same

Semiconductor device having a heat sink with bumpers for protecting...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR CONNECTION COMPONENT

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

SEMICONDUCTOR CONNECTION COMPONENT

Semiconductor device and manufacturing method of the same

Semiconductor device and method of producing the same

Semiconductor device and method of producing the same