Atsushi Nishizawa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Etching method
- Patent number 6,617,244
- Issue date Sep 9, 2003
- NEC Corporation
- Atsushi Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing structure for bumps on a semiconductor integrated circuit chip
- Patent number 5,600,180
- Issue date Feb 4, 1997
- NEC Corporation
- Teruo Kusaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level wiring structure having an organic interlayer insulatin...
- Patent number 5,310,965
- Issue date May 10, 1994
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of etching silicon nitride film and method of producing semi...
- Publication number 20030203631
- Publication date Oct 30, 2003
- NEC Corporation
- Atsushi Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20020119677
- Publication date Aug 29, 2002
- Eiichi Soda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching method
- Publication number 20020037648
- Publication date Mar 28, 2002
- NEC Corporation
- Atsushi Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for fabricating same
- Publication number 20010023990
- Publication date Sep 27, 2001
- Takashi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method semiconductor integrated circuit including sim...
- Publication number 20010008802
- Publication date Jul 19, 2001
- NEC CORP
- Atsushi Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of etching silicon nitride film and method of producing semi...
- Publication number 20010005636
- Publication date Jun 28, 2001
- NEC Corporation
- Atsushi Nishizawa
- H01 - BASIC ELECTRIC ELEMENTS