Atsushi Ogino

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
High performance metal insulator metal capacitor
- Patent number 11,437,312
- Issue date Sep 6, 2022
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple patterning with mandrel cuts defined by block masks
- Patent number 11,417,525
- Issue date Aug 16, 2022
- GLOBALFOUNDRIES U.S. INC.
- Martin O'Toole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked via rivets in chip hotspots
- Patent number 11,308,257
- Issue date Apr 19, 2022
- International Business Machines Corporation
- Dureseti Chidambarrao
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Dual airgap structure
- Patent number 11,101,170
- Issue date Aug 24, 2021
- GLOBALFOUNDRIES U.S. INC.
- Motoi Ichihashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structures connected with the lowest metallization levels in a...
- Patent number 10,796,973
- Issue date Oct 6, 2020
- GLOBALFOUNDRIES Inc.
- Mankyu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure leveraging the lowest metallization level of an inte...
- Patent number 10,790,204
- Issue date Sep 29, 2020
- GLOBALFOUNDRIES Inc.
- Mankyu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip resistors with direct wiring connections
- Patent number 10,566,411
- Issue date Feb 18, 2020
- GLOBALFOUNDRIES Inc.
- Atsushi Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having power rail structure and related method
- Patent number 10,438,890
- Issue date Oct 8, 2019
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce resistance for a copper (Cu) interconnect landing...
- Patent number 10,403,574
- Issue date Sep 3, 2019
- GLOBALFOUNDRIES Inc.
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual airgap structure
- Patent number 10,395,980
- Issue date Aug 27, 2019
- GLOBALFOUNDRIES Inc.
- Motoi Ichihashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices using semi-bidirectional p...
- Patent number 10,229,918
- Issue date Mar 12, 2019
- GLOBALFOUNDRIES Inc.
- Atsushi Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On-chip capacitors with floating islands
- Patent number 10,147,783
- Issue date Dec 4, 2018
- GLOBALFOUNDRIES Inc.
- Atsushi Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure having power rail structure and related method
- Patent number 9,997,456
- Issue date Jun 12, 2018
- GLOBALFOUNDRIES Inc.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce resistance for a copper (CU) interconnect landing...
- Patent number 9,991,202
- Issue date Jun 5, 2018
- GLOBALFOUNDRIES Inc.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of conductive bus bar for resistive seed subst...
- Patent number 9,899,324
- Issue date Feb 20, 2018
- GLOBALFOUNDRIES Inc.
- Shafaat Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices using semi-bidirectional p...
- Patent number 9,865,473
- Issue date Jan 9, 2018
- GLOBALFOUNDRIES Inc.
- Atsushi Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of IC structure with metal plug
- Patent number 9,793,216
- Issue date Oct 17, 2017
- GLOBALFOUNDRIES Inc.
- Joyeeta Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor devices using semi-bidirectional p...
- Patent number 9,748,251
- Issue date Aug 29, 2017
- GLOBALFOUNDRIES Inc.
- Atsushi Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with metal crack stop and methods of f...
- Patent number 9,589,911
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structure with crack stop and method of forming...
- Patent number 9,589,912
- Issue date Mar 7, 2017
- GLOBALFOUNDRIES Inc.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH PERFORMANCE METAL INSULATOR METAL CAPACITOR
- Publication number 20210249349
- Publication date Aug 12, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE LEVERAGING THE LOWEST METALLIZATION LEVEL OF AN INTE...
- Publication number 20200152530
- Publication date May 14, 2020
- GLOBALFOUNDRIES INC.
- Mankyu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURES CONNECTED WITH THE LOWEST METALLIZATION LEVELS IN A...
- Publication number 20200152531
- Publication date May 14, 2020
- GLOBALFOUNDRIES INC.
- Mankyu Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE PATTERNING WITH MANDREL CUTS DEFINED BY BLOCK MASKS
- Publication number 20200111668
- Publication date Apr 9, 2020
- GLOBALFOUNDRIES INC.
- Martin O'Toole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL AIRGAP STRUCTURE
- Publication number 20190333801
- Publication date Oct 31, 2019
- GLOBALFOUNDRIES INC.
- Motoi ICHIHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL AIRGAP STRUCTURE
- Publication number 20190259649
- Publication date Aug 22, 2019
- GLOBALFOUNDRIES INC.
- Motoi ICHIHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP RESISTORS WITH DIRECT WIRING CONNECTIONS
- Publication number 20190181215
- Publication date Jun 13, 2019
- GLOBALFOUNDRIES INC.
- Atsushi Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP CAPACITORS WITH FLOATING ISLANDS
- Publication number 20180269275
- Publication date Sep 20, 2018
- GLOBALFOUNDRIES INC.
- Atsushi Ogino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING POWER RAIL STRUCTURE AND RELATED METHOD
- Publication number 20180261538
- Publication date Sep 13, 2018
- GLOBALFOUNDRIES INC.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICES USING SEMI-BIDIRECTIONAL P...
- Publication number 20180138187
- Publication date May 17, 2018
- GLOBALFOUNDRIES INC.
- Atsushi OGINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING...
- Publication number 20180096933
- Publication date Apr 5, 2018
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE HAVING POWER RAIL STRUCTURE AND RELATED METHOD
- Publication number 20180033718
- Publication date Feb 1, 2018
- GLOBALFOUNDRIES INC.
- Erdem Kaltalioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF IC STRUCTURE WITH METAL PLUG
- Publication number 20170213792
- Publication date Jul 27, 2017
- GLOBALFOUNDRIES INC.
- Joyeeta Nag
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH CRACK STOP AND METHOD OF FORMING...
- Publication number 20170062355
- Publication date Mar 2, 2017
- GLOBALFOUNDRIES INC.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH METAL CRACK STOP AND METHODS OF F...
- Publication number 20170062354
- Publication date Mar 2, 2017
- GLOBALFOUNDRIES INC.
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING...
- Publication number 20170005037
- Publication date Jan 5, 2017
- International Business Machines Corporation
- Jim S. Liang
- H01 - BASIC ELECTRIC ELEMENTS

Atsushi Ogino

Person

Patents Grantslast 30 patents

High performance metal insulator metal capacitor

Multiple patterning with mandrel cuts defined by block masks

Stacked via rivets in chip hotspots

Dual airgap structure

Test structures connected with the lowest metallization levels in a...

Test structure leveraging the lowest metallization level of an inte...

On-chip resistors with direct wiring connections

Interconnect structure having power rail structure and related method

Method to reduce resistance for a copper (Cu) interconnect landing...

Dual airgap structure

Methods of forming semiconductor devices using semi-bidirectional p...

On-chip capacitors with floating islands

Interconnect structure having power rail structure and related method

Method to reduce resistance for a copper (CU) interconnect landing...

Structure and method of conductive bus bar for resistive seed subst...

Methods of forming semiconductor devices using semi-bidirectional p...

Fabrication of IC structure with metal plug

Methods of forming semiconductor devices using semi-bidirectional p...

Integrated circuit structure with metal crack stop and methods of f...

Integrated circuit structure with crack stop and method of forming...

Patents Applicationslast 30 patents

HIGH PERFORMANCE METAL INSULATOR METAL CAPACITOR

TEST STRUCTURE LEVERAGING THE LOWEST METALLIZATION LEVEL OF AN INTE...

TEST STRUCTURES CONNECTED WITH THE LOWEST METALLIZATION LEVELS IN A...

MULTIPLE PATTERNING WITH MANDREL CUTS DEFINED BY BLOCK MASKS

DUAL AIRGAP STRUCTURE

DUAL AIRGAP STRUCTURE

ON-CHIP RESISTORS WITH DIRECT WIRING CONNECTIONS

ON-CHIP CAPACITORS WITH FLOATING ISLANDS

INTERCONNECT STRUCTURE HAVING POWER RAIL STRUCTURE AND RELATED METHOD

METHODS OF FORMING SEMICONDUCTOR DEVICES USING SEMI-BIDIRECTIONAL P...

METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING...

INTERCONNECT STRUCTURE HAVING POWER RAIL STRUCTURE AND RELATED METHOD

FABRICATION OF IC STRUCTURE WITH METAL PLUG

INTEGRATED CIRCUIT STRUCTURE WITH CRACK STOP AND METHOD OF FORMING...

INTEGRATED CIRCUIT STRUCTURE WITH METAL CRACK STOP AND METHODS OF F...

METHOD TO REDUCE RESISTANCE FOR A COPPER (CU) INTERCONNECT LANDING...