Atsushi Sekiguchi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer processing method and plasma processing apparatus
- Patent number 12,051,574
- Issue date Jul 30, 2024
- HITACHI HIGH-TECH CORPORATION
- Hiroyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma processing apparatus and plasma processing method
- Patent number 11,875,978
- Issue date Jan 16, 2024
- HITACHI HIGH-TECH CORPORATION
- Tsubasa Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a copper thin film
- Patent number 6,887,522
- Issue date May 3, 2005
- Anelva Corporation
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and system for forming copper thin film
- Patent number 6,726,954
- Issue date Apr 27, 2004
- Anelva Corporation
- Minjuan Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for the formation of copper wiring films
- Patent number 6,562,219
- Issue date May 13, 2003
- Anelva Corporation
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing titanium nitride thin film and CVD deposition...
- Patent number 6,471,781
- Issue date Oct 29, 2002
- Anelva Corporation
- Ryoki Tobe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing a titanium nitride thin film
- Patent number 6,468,604
- Issue date Oct 22, 2002
- Anelva Corporation
- Ryoki Tobe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Single substrate processing CVD procedure for depositing a metal fi...
- Patent number 6,387,444
- Issue date May 14, 2002
- Anelva Corporation
- Osamu Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing titanium nitride thin film and CVD deposition...
- Patent number 6,080,446
- Issue date Jun 27, 2000
- Anelva Corporation
- Ryoki Tobe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of cleaning metallic films built up within thin film deposit...
- Patent number 5,993,679
- Issue date Nov 30, 1999
- Anelva Corporation
- Tomoaki Koide
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced CVD apparatus and process, and dry etching apparatu...
- Patent number 5,891,349
- Issue date Apr 6, 1999
- Anelva Corporation
- Ryoki Tobe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced CVD apparatus, plasma enhanced processing apparatus...
- Patent number 5,855,685
- Issue date Jan 5, 1999
- Anelva Corporation
- Ryoki Tobe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a thin film and apparatus of forming a metal thi...
- Patent number 5,744,377
- Issue date Apr 28, 1998
- Anelva Corporation
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing titanium-containing conductive thin film
- Patent number 5,721,021
- Issue date Feb 24, 1998
- Anelva Corporation
- Ryoki Tobe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Titanium nitride film-MOCVD method incorporating use of tetrakisdia...
- Patent number 5,672,385
- Issue date Sep 30, 1997
- Anelva Corporation
- Hitoshi Jimba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming a thin film and apparatus of forming a metal thin...
- Patent number 5,594,280
- Issue date Jan 14, 1997
- Anelva Corporation
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of improving or producing oxide superconductor
- Patent number 5,376,628
- Issue date Dec 27, 1994
- Anelva Corporation
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for forming a metal thin film utilizing temperature contr...
- Patent number 4,981,103
- Issue date Jan 1, 1991
- Anelva Corporation
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a thin film and apparatus of forming a metal thi...
- Patent number 4,963,423
- Issue date Oct 16, 1990
- Anelva Corporation
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for processing an object by gas plasma with a reduced damage
- Patent number 4,919,783
- Issue date Apr 24, 1990
- Anelva Corporation
- Tatsuo Asamaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface processing apparatus utilizing local thermal equilibrium pl...
- Patent number 4,664,747
- Issue date May 12, 1987
- Anelva Corporation
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WAFER PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20230118576
- Publication date Apr 20, 2023
- Hitachi High-Tech Corporation
- Hiroyuki Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
- Publication number 20230096723
- Publication date Mar 30, 2023
- Hitachi High-Tech Corporation
- Tsubasa Okamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming a copper thin film
- Publication number 20020157610
- Publication date Oct 31, 2002
- Atsushi Sekiguchi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for the formation of copper wiring films
- Publication number 20020134686
- Publication date Sep 26, 2002
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and system for forming copper thin film
- Publication number 20020052109
- Publication date May 2, 2002
- Minjuan Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and manufacturing device for manufacturing a titanium nitrid...
- Publication number 20020015791
- Publication date Feb 7, 2002
- Ryoki Tobe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CVD apparatus and CVD method for copper deposition
- Publication number 20010006701
- Publication date Jul 5, 2001
- Akiko Kobayashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Atsushi Sekiguchi

Person

Patents Grantslast 30 patents

Wafer processing method and plasma processing apparatus

Plasma processing apparatus and plasma processing method

Method for forming a copper thin film

Method and system for forming copper thin film

Method for the formation of copper wiring films

Method of depositing titanium nitride thin film and CVD deposition...

Method for manufacturing a titanium nitride thin film

Single substrate processing CVD procedure for depositing a metal fi...

Method of depositing titanium nitride thin film and CVD deposition...

Method of cleaning metallic films built up within thin film deposit...

Plasma enhanced CVD apparatus and process, and dry etching apparatu...

Plasma enhanced CVD apparatus, plasma enhanced processing apparatus...

Method for forming a thin film and apparatus of forming a metal thi...

Method of depositing titanium-containing conductive thin film

Titanium nitride film-MOCVD method incorporating use of tetrakisdia...

Method of forming a thin film and apparatus of forming a metal thin...

Method of improving or producing oxide superconductor

Apparatus for forming a metal thin film utilizing temperature contr...

Method for forming a thin film and apparatus of forming a metal thi...

Apparatus for processing an object by gas plasma with a reduced damage

Surface processing apparatus utilizing local thermal equilibrium pl...

Patents Applicationslast 30 patents

WAFER PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD

Method for forming a copper thin film

Method for the formation of copper wiring films

Method and system for forming copper thin film

Method and manufacturing device for manufacturing a titanium nitrid...

CVD apparatus and CVD method for copper deposition