TREA

Atsushi SHIMADA

Follow

Person

  • Yamanashi, JP
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Film forming apparatus and film forming method
    • Patent number 12,163,215
    • Issue date Dec 10, 2024
    • Tokyo Electron Limited
    • Koji Maeda
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Deposition device and deposition method
    • Patent number 10,309,005
    • Issue date Jun 4, 2019
    • Tokyo Electron Limited
    • Yasuhiko Kojima
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Method for forming copper film
    • Patent number 10,189,230
    • Issue date Jan 29, 2019
    • Tokyo Electron Limited
    • Hiroyuki Toshima
    • C01 - INORGANIC CHEMISTRY
  • Information Patent Grant

    Method of supplying cobalt to recess
    • Patent number 9,362,167
    • Issue date Jun 7, 2016
    • Tokyo Electron Limited
    • Atsushi Shimada
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for forming copper wiring
    • Patent number 9,313,895
    • Issue date Apr 12, 2016
    • Tokyo Electron Limited
    • Tadahiro Ishizaka
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

  • Information Patent Application

    FILM FORMING APPARATUS AND FILM FORMING METHOD
    • Publication number 20250059640
    • Publication date Feb 20, 2025
    • TOKYO ELECTRON LIMITED
    • Koji MAEDA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FILM FORMATION METHOD AND FILM FORMATION DEVICE
    • Publication number 20240274420
    • Publication date Aug 15, 2024
    • TOKYO ELECTRON LIMITED
    • Atsushi SHIMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FILM FORMING APPARATUS AND FILM FORMING METHOD
    • Publication number 20220403503
    • Publication date Dec 22, 2022
    • TOKYO ELECTRON LIMITED
    • Hiroyuki Iwashita
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    PLASMA PROCESSING APPARATUS
    • Publication number 20220336194
    • Publication date Oct 20, 2022
    • TOKYO ELECTRON LIMITED
    • Hiroyuki YOKOHARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FILM FORMING APPARATUS AND FILM FORMING METHOD
    • Publication number 20220178014
    • Publication date Jun 9, 2022
    • TOKYO ELECTRON LIMITED
    • Koji MAEDA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    METHOD FOR FORMING COPPER FILM
    • Publication number 20180001597
    • Publication date Jan 4, 2018
    • Hiroyuki TOSHIMA
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    DEPOSITION DEVICE AND DEPOSITION METHOD
    • Publication number 20160251746
    • Publication date Sep 1, 2016
    • Tokyo Electron Limited
    • Yasuhiko KOJIMA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    Method of Supplying Cobalt to Recess
    • Publication number 20150243556
    • Publication date Aug 27, 2015
    • TOKYO ELECTRON LIMITED
    • Atsushi SHIMADA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD FOR FORMING COPPER WIRING
    • Publication number 20140161992
    • Publication date Jun 12, 2014
    • TOKYO ELECTRON LIMITED
    • Tadahiro ISHIZAKA
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...