Atsushi Takano

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bulk acoustic wave component with conductor extending laterally fro...
- Patent number 11,811,385
- Issue date Nov 7, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Stacked acoustic wave resonator package with laser-drilled VIAS
- Patent number 11,581,870
- Issue date Feb 14, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic package including cavity formed by removal of sacrificia...
- Patent number 11,545,952
- Issue date Jan 3, 2023
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of plasma dicing bulk acoustic wave components
- Patent number 11,496,111
- Issue date Nov 8, 2022
- Skyworks Solutions, Inc.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bulk acoustic wave components
- Patent number 11,251,769
- Issue date Feb 15, 2022
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic devices formed in a cavity between substrates
- Patent number 11,050,407
- Issue date Jun 29, 2021
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package including cavity defined by resin and method of...
- Patent number 10,999,932
- Issue date May 4, 2021
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic devices formed in a cavity between substrates and includ...
- Patent number 10,965,269
- Issue date Mar 30, 2021
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of manufacturing electronic devices formed in a cavity and...
- Patent number 10,763,820
- Issue date Sep 1, 2020
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package including cavity formed by removal of sacrificia...
- Patent number 10,574,202
- Issue date Feb 25, 2020
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of manufacturing electronic devices formed in a cavity
- Patent number 10,439,587
- Issue date Oct 8, 2019
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package including cavity defined by resin and method of...
- Patent number 10,321,572
- Issue date Jun 11, 2019
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device with integrated inductor
- Patent number 9,325,295
- Issue date Apr 26, 2016
- SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD
- Hideaki Nakayama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Elastic wave device
- Patent number 9,124,239
- Issue date Sep 1, 2015
- SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD
- Hideaki Nakayama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device and method for manufacturing the same
- Patent number 7,982,364
- Issue date Jul 19, 2011
- Panasonic Corporation
- Ryouichi Takayama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Under bump metal film comprising a stress relaxation layer and a di...
- Patent number 7,764,007
- Issue date Jul 27, 2010
- Panasonic Corporation
- Mitsuhiro Furukawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package
- Patent number 7,652,214
- Issue date Jan 26, 2010
- Panasonic Corporation
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component package
- Patent number 7,649,235
- Issue date Jan 19, 2010
- Panasonic Corporation
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic component package
- Patent number 7,622,684
- Issue date Nov 24, 2009
- Panasonic Corporation
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package
- Patent number 7,382,081
- Issue date Jun 3, 2008
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Surface acoustic wave device and process for fabricating the same
- Patent number 7,148,769
- Issue date Dec 12, 2006
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Takano
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
ACOUSTIC WAVE RESONATOR BACK END SILICON DIOXIDE VIA FORMATION
- Publication number 20240113685
- Publication date Apr 4, 2024
- Skyworks Solutions, Inc.
- Yiliu Wang
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING BUFFE...
- Publication number 20240097640
- Publication date Mar 21, 2024
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS
- Publication number 20240072758
- Publication date Feb 29, 2024
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MULTILAYER PIEZOELECTRIC SUBSTRATE PACKAGING METHOD FOR STACKING ST...
- Publication number 20240039516
- Publication date Feb 1, 2024
- Skyworks Solutions, Inc.
- Rei Goto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR FORMING ACOUSTIC WAVE DEVICE
- Publication number 20230147060
- Publication date May 11, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED FILTER PACKAGE HAVING MULTIPLE TYPES OF ACOUSTIC WAVE DEVICES
- Publication number 20230142089
- Publication date May 11, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING SILIC...
- Publication number 20230115592
- Publication date Apr 13, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SUBSTRATE HAVING A METAL LAYER COMPRISING A MARKING
- Publication number 20230104665
- Publication date Apr 6, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS
- Publication number 20230059917
- Publication date Feb 23, 2023
- Skyworks Solutions, Inc.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-SHIELDED ACOUSTIC WAVE DEVICE PACKAGE
- Publication number 20220321090
- Publication date Oct 6, 2022
- Skyworks Solutions, Inc.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MAKING STACKED ACOUSTIC WAVE RESONATOR PACKAGE WITH LASER...
- Publication number 20210152151
- Publication date May 20, 2021
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF MAKING ACOUSTIC WAVE RESONATOR WITH LASER-DRILLED VIAS
- Publication number 20210119608
- Publication date Apr 22, 2021
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ACOUSTIC WAVE RESONATOR WITH LASER-DRILLED VIAS
- Publication number 20210119607
- Publication date Apr 22, 2021
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
STACKED ACOUSTIC WAVE RESONATOR PACKAGE WITH LASER-DRILLED VIAS
- Publication number 20210099157
- Publication date Apr 1, 2021
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY FORMED BY REMOVAL OF SACRIFICIA...
- Publication number 20200153407
- Publication date May 14, 2020
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
BULK ACOUSTIC WAVE COMPONENTS
- Publication number 20200127633
- Publication date Apr 23, 2020
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS
- Publication number 20200127632
- Publication date Apr 23, 2020
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC DEVICES FORMED IN A CAVITY BETWEEN SUBSTRATES
- Publication number 20200021269
- Publication date Jan 16, 2020
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...
- Publication number 20190246500
- Publication date Aug 8, 2019
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING ELECTRONIC DEVICES FORMED IN A CAVITY
- Publication number 20180159493
- Publication date Jun 7, 2018
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICES FORMED IN A CAVITY BETWEEN SUBSTRATES AND INCLUD...
- Publication number 20180159503
- Publication date Jun 7, 2018
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING ELECTRONIC DEVICES TO PREVENT WATER INGRES...
- Publication number 20180159502
- Publication date Jun 7, 2018
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING ELECTRONIC DEVICES FORMED IN A CAVITY AND...
- Publication number 20180158801
- Publication date Jun 7, 2018
- SKYWORKS SOLUTIONS, INC.
- Atsushi Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...
- Publication number 20170290160
- Publication date Oct 5, 2017
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE INCLUDING CAVITY FORMED BY REMOVAL OF SACRIFICIA...
- Publication number 20170288627
- Publication date Oct 5, 2017
- SKYWORKS FILTER SOLUTIONS JAPAN CO., LTD.
- Atsushi Takano
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELASTIC WAVE DEVICE WITH INTEGRATED INDUCTOR
- Publication number 20160036416
- Publication date Feb 4, 2016
- SKYWORKS PANASONIC FILTER SOLUTIONS JAPAN CO., LTD
- Hideaki Nakayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELASTIC WAVE DEVICE
- Publication number 20120280768
- Publication date Nov 8, 2012
- PANASONIC CORPORATION
- Hideaki Nakayama
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20090194325
- Publication date Aug 6, 2009
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20090071711
- Publication date Mar 19, 2009
- Matsushita Electric Industrial Co., Ltd.
- Atsushi Takano
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Surface Acoustic Wave Device and Method for Manufacturing the Same
- Publication number 20090051245
- Publication date Feb 26, 2009
- Ryouichi Takayama
- H03 - BASIC ELECTRONIC CIRCUITRY

Atsushi Takano

Person

Patents Grantslast 30 patents

Bulk acoustic wave component with conductor extending laterally fro...

Stacked acoustic wave resonator package with laser-drilled VIAS

Electronic package including cavity formed by removal of sacrificia...

Methods of plasma dicing bulk acoustic wave components

Bulk acoustic wave components

Electronic devices formed in a cavity between substrates

Electronic package including cavity defined by resin and method of...

Electronic devices formed in a cavity between substrates and includ...

Methods of manufacturing electronic devices formed in a cavity and...

Electronic package including cavity formed by removal of sacrificia...

Methods of manufacturing electronic devices formed in a cavity

Electronic package including cavity defined by resin and method of...

Elastic wave device with integrated inductor

Elastic wave device

Surface acoustic wave device and method for manufacturing the same

Under bump metal film comprising a stress relaxation layer and a di...

Electronic component package

Electronic component package

Electronic component package

Electronic component package

Surface acoustic wave device and process for fabricating the same

Patents Applicationslast 30 patents

ACOUSTIC WAVE RESONATOR BACK END SILICON DIOXIDE VIA FORMATION

BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING BUFFE...

METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS

MULTILAYER PIEZOELECTRIC SUBSTRATE PACKAGING METHOD FOR STACKING ST...

METHOD FOR FORMING ACOUSTIC WAVE DEVICE

STACKED FILTER PACKAGE HAVING MULTIPLE TYPES OF ACOUSTIC WAVE DEVICES

BULK ACOUSTIC WAVE DEVICE PACKAGING WITH REDISTRIBUTION USING SILIC...

SUBSTRATE HAVING A METAL LAYER COMPRISING A MARKING

METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS

SELF-SHIELDED ACOUSTIC WAVE DEVICE PACKAGE

METHOD OF MAKING STACKED ACOUSTIC WAVE RESONATOR PACKAGE WITH LASER...

METHOD OF MAKING ACOUSTIC WAVE RESONATOR WITH LASER-DRILLED VIAS

ACOUSTIC WAVE RESONATOR WITH LASER-DRILLED VIAS

STACKED ACOUSTIC WAVE RESONATOR PACKAGE WITH LASER-DRILLED VIAS

ELECTRONIC PACKAGE INCLUDING CAVITY FORMED BY REMOVAL OF SACRIFICIA...

BULK ACOUSTIC WAVE COMPONENTS

METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS

ELECTRONIC DEVICES FORMED IN A CAVITY BETWEEN SUBSTRATES

ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...

METHODS OF MANUFACTURING ELECTRONIC DEVICES FORMED IN A CAVITY

ELECTRONIC DEVICES FORMED IN A CAVITY BETWEEN SUBSTRATES AND INCLUD...

METHODS OF MANUFACTURING ELECTRONIC DEVICES TO PREVENT WATER INGRES...

METHODS OF MANUFACTURING ELECTRONIC DEVICES FORMED IN A CAVITY AND...

ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF...

ELECTRONIC PACKAGE INCLUDING CAVITY FORMED BY REMOVAL OF SACRIFICIA...

ELASTIC WAVE DEVICE WITH INTEGRATED INDUCTOR

ELASTIC WAVE DEVICE

ELECTRONIC COMPONENT PACKAGE

ELECTRONIC COMPONENT PACKAGE

Surface Acoustic Wave Device and Method for Manufacturing the Same