Atsushi TSUURA

Person

Annaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Low-dielectric heat dissipation film composition and low-dielectric...
- Patent number 11,608,438
- Issue date Mar 21, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki Iguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Slurry composition, cured product of the slurry composition, and su...
- Patent number 11,530,324
- Issue date Dec 20, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Slurry composition, cured product of the slurry composition, and su...
- Patent number 11,267,966
- Issue date Mar 8, 2022
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro Tsutsumi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
BISMALEIMIDE COMPOUND, RESIN VARNISH, AND PRODUCTION METHOD THEREOF
- Publication number 20240182646
- Publication date Jun 6, 2024
- Shin-Etsu Chemical Co., Ltd.
- Yuki KUDO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...
- Publication number 20230416466
- Publication date Dec 28, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION
- Publication number 20230143093
- Publication date May 11, 2023
- Shin-Etsu Chemical Co., Ltd.
- Atsushi TSUURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HEAT-CURABLE MALEIMIDE RESIN COMPOSITION, FILM, PREPREG, LAMINATE A...
- Publication number 20230140237
- Publication date May 4, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- B32 - LAYERED PRODUCTS
Information Patent Application
CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COP...
- Publication number 20230130867
- Publication date Apr 27, 2023
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOCURABLE MALEIMIDE RESIN COMPOSITION
- Publication number 20230040536
- Publication date Feb 9, 2023
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD (FPC), AND H...
- Publication number 20220306920
- Publication date Sep 29, 2022
- Shin-Etsu Chemical Co., Ltd.
- Atsushi TSUURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MALEIMIDE RESIN COMPOSITION AND MALEIMIDE RESIN FILM
- Publication number 20210079219
- Publication date Mar 18, 2021
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
HEAT-CURABLE RESIN COMPOSITION, AND ADHESIVE AGENT, FILM, PREPREG,...
- Publication number 20210054152
- Publication date Feb 25, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
AROMATIC BISMALEIMIDE COMPOUND, PRODUCTION METHOD THEREOF, AND HEAT...
- Publication number 20210017337
- Publication date Jan 21, 2021
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
LOW-DIELECTRIC HEAT DISSIPATION FILM COMPOSITION AND LOW-DIELECTRIC...
- Publication number 20200325334
- Publication date Oct 15, 2020
- Shin-Etsu Chemical Co., Ltd.
- Hiroyuki IGUCHI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SLURRY COMPOSITION, CURED PRODUCT OF THE SLURRY COMPOSITION, AND SU...
- Publication number 20200317916
- Publication date Oct 8, 2020
- Shin-Etsu Chemical Co., Ltd.
- Yoshihiro TSUTSUMI
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Atsushi TSUURA

Person

Patents Grantslast 30 patents

Low-dielectric heat dissipation film composition and low-dielectric...

Slurry composition, cured product of the slurry composition, and su...

Slurry composition, cured product of the slurry composition, and su...

Patents Applicationslast 30 patents

BISMALEIMIDE COMPOUND, RESIN VARNISH, AND PRODUCTION METHOD THEREOF

CURABLE RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATION MATERIAL, AD...

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION, FILM, PREPREG, LAMINATE A...

CYCLIC IMIDE RESIN COMPOSITION, LIQUID ADHESIVE, FILM, PREPREG, COP...

PHOTOCURABLE MALEIMIDE RESIN COMPOSITION

ADHESIVE COMPOSITION FOR FLEXIBLE PRINTED-WIRING BOARD (FPC), AND H...

MALEIMIDE RESIN COMPOSITION AND MALEIMIDE RESIN FILM

HEAT-CURABLE RESIN COMPOSITION, AND ADHESIVE AGENT, FILM, PREPREG,...

AROMATIC BISMALEIMIDE COMPOUND, PRODUCTION METHOD THEREOF, AND HEAT...

LOW-DIELECTRIC HEAT DISSIPATION FILM COMPOSITION AND LOW-DIELECTRIC...

SLURRY COMPOSITION, CURED PRODUCT OF THE SLURRY COMPOSITION, AND SU...