Atsushi Ueki

Person

Ota-Ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laser processing apparatus and method of adjusting phase pattern
- Patent number 12,030,137
- Issue date Jul 9, 2024
- Disco Corporation
- Teppei Nomura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus and adjustment method for laser processi...
- Patent number 11,752,574
- Issue date Sep 12, 2023
- Disco Corporation
- Atsushi Ueki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser beam spot shape correcting method
- Patent number 11,621,201
- Issue date Apr 4, 2023
- Disco Corporation
- Atsushi Ueki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing apparatus with calculating section
- Patent number 11,351,631
- Issue date Jun 7, 2022
- Disco Corporation
- Atsushi Ueki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser processing method
- Patent number 11,325,205
- Issue date May 10, 2022
- Disco Corporation
- Atsushi Ueki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer processing method
- Patent number 10,580,698
- Issue date Mar 3, 2020
- Disco Corporation
- Atsushi Ueki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer dividing method and dividing apparatus
- Patent number 10,559,487
- Issue date Feb 11, 2020
- Disco Corporation
- Atsushi Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mobile station, mobile communication system, and network device
- Patent number 10,292,090
- Issue date May 14, 2019
- NTT DoCoMo, Inc.
- Atsushi Ueki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method for using a test wafer by forming modified layer using a las...
- Patent number 10,249,547
- Issue date Apr 2, 2019
- DISCO CORPORTATION
- Satoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip spacing maintaining apparatus
- Patent number 9,991,151
- Issue date Jun 5, 2018
- Disco Corporation
- Atsushi Hattori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mobile communication method and mobile station to prohibit retransm...
- Patent number 9,794,778
- Issue date Oct 17, 2017
- NTT DoCoMo, Inc.
- Yasufumi Morioka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mobile station, networking apparatus, and mobile communication method
- Patent number 9,591,487
- Issue date Mar 7, 2017
- NTT DoCoMo, Inc.
- Atsushi Ueki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Mobile station
- Patent number 9,560,578
- Issue date Jan 31, 2017
- NTT DoCoMo, Inc.
- Kenichiro Aoyagi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Laser processing method for workpiece
- Patent number 8,258,046
- Issue date Sep 4, 2012
- Disco Corporation
- Atsushi Ueki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
DETECTION METHOD OF RESISTIVITY AND PROCESSING METHOD OF PLATE-SHAP...
- Publication number 20230398641
- Publication date Dec 14, 2023
- Disco Corporation
- Atsushi UEKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
EXPANSION METHOD
- Publication number 20230298925
- Publication date Sep 21, 2023
- Disco Corporation
- Atsushi UEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER PROCESSING APPARATUS AND ADJUSTMENT METHOD FOR LASER PROCESSI...
- Publication number 20210276123
- Publication date Sep 9, 2021
- Disco Corporation
- Atsushi UEKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER BEAM SPOT SHAPE CORRECTING METHOD
- Publication number 20210183714
- Publication date Jun 17, 2021
- Disco Corporation
- Atsushi UEKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS AND METHOD OF ADJUSTING PHASE PATTERN
- Publication number 20210146482
- Publication date May 20, 2021
- Disco Corporation
- Teppei NOMURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20210008661
- Publication date Jan 14, 2021
- Disco Corporation
- Atsushi UEKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING METHOD
- Publication number 20200306877
- Publication date Oct 1, 2020
- Disco Corporation
- Atsushi UEKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER PROCESSING METHOD
- Publication number 20190164832
- Publication date May 30, 2019
- Disco Corporation
- Atsushi UEKI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER DIVIDING METHOD AND DIVIDING APPARATUS
- Publication number 20180358256
- Publication date Dec 13, 2018
- Disco Corporation
- Atsushi Ueki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST WAFER AND USING METHOD THEREFOR
- Publication number 20170040235
- Publication date Feb 9, 2017
- Disco Corporation
- Satoshi Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOBILE STATION, MOBILE COMMUNICATION SYSTEM, AND NETWORK DEVICE
- Publication number 20160242106
- Publication date Aug 18, 2016
- NTT DoCoMo, Inc.
- Atsushi Ueki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOBILE COMMUNICATION TERMINAL AND RADIO ACCESS NETWORK DEVICE
- Publication number 20160088672
- Publication date Mar 24, 2016
- NTT DoCoMo, Inc.
- Atsushi UEKI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
CHIP SPACING MAINTAINING APPARATUS
- Publication number 20160007479
- Publication date Jan 7, 2016
- Disco Corporation
- Atsushi Hattori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GaN SUBSTRATE, AND METHOD FOR MANUFACTURING GaN SUBSTRATE
- Publication number 20150368832
- Publication date Dec 24, 2015
- Disco Corporation
- Hideo AIDA
- C30 - CRYSTAL GROWTH
Information Patent Application
MOBILE COMMUNICATION TERMINAL AND RADIO ACCESS NETWORK DEVICE
- Publication number 20150351150
- Publication date Dec 3, 2015
- NTT DoCoMo, Inc.
- Sung Uk Moon
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOBILE STATION, NETWORKING APPARATUS, AND MOBILE COMMUNICATION METHOD
- Publication number 20150230092
- Publication date Aug 13, 2015
- NTT DoCoMo, Inc.
- Atsushi Ueki
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOBILE STATION
- Publication number 20150163727
- Publication date Jun 11, 2015
- NTT DoCoMo, Inc.
- Kenichiro Aoyagi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOBILE COMMUNICATION METHOD AND MOBILE STATION
- Publication number 20150156625
- Publication date Jun 4, 2015
- NTT DoCoMo, Inc.
- Yasufumi Morioka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOBILE COMMUNICATION METHOD
- Publication number 20150131476
- Publication date May 14, 2015
- NTT DoCoMo, Inc.
- Yasufumi Morioka
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LASER PROCESSING METHOD FOR WORKPIECE
- Publication number 20110056922
- Publication date Mar 10, 2011
- Disco Corporation
- Atsushi Ueki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Atsushi Ueki

Person

Patents Grantslast 30 patents

Laser processing apparatus and method of adjusting phase pattern

Laser processing apparatus and adjustment method for laser processi...

Laser beam spot shape correcting method

Laser processing apparatus with calculating section

Laser processing method

Wafer processing method

Wafer dividing method and dividing apparatus

Mobile station, mobile communication system, and network device

Method for using a test wafer by forming modified layer using a las...

Chip spacing maintaining apparatus

Mobile communication method and mobile station to prohibit retransm...

Mobile station, networking apparatus, and mobile communication method

Mobile station

Laser processing method for workpiece

Patents Applicationslast 30 patents

DETECTION METHOD OF RESISTIVITY AND PROCESSING METHOD OF PLATE-SHAP...

EXPANSION METHOD

LASER PROCESSING APPARATUS AND ADJUSTMENT METHOD FOR LASER PROCESSI...

LASER BEAM SPOT SHAPE CORRECTING METHOD

LASER PROCESSING APPARATUS AND METHOD OF ADJUSTING PHASE PATTERN

LASER PROCESSING APPARATUS

LASER PROCESSING METHOD

WAFER PROCESSING METHOD

WAFER DIVIDING METHOD AND DIVIDING APPARATUS

TEST WAFER AND USING METHOD THEREFOR

MOBILE STATION, MOBILE COMMUNICATION SYSTEM, AND NETWORK DEVICE

MOBILE COMMUNICATION TERMINAL AND RADIO ACCESS NETWORK DEVICE

CHIP SPACING MAINTAINING APPARATUS

GaN SUBSTRATE, AND METHOD FOR MANUFACTURING GaN SUBSTRATE

MOBILE COMMUNICATION TERMINAL AND RADIO ACCESS NETWORK DEVICE

MOBILE STATION, NETWORKING APPARATUS, AND MOBILE COMMUNICATION METHOD

MOBILE STATION

MOBILE COMMUNICATION METHOD AND MOBILE STATION

MOBILE COMMUNICATION METHOD

LASER PROCESSING METHOD FOR WORKPIECE