Atsushi Yabe

Person

Kitaibaraki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate and manufacturing method therefor
- Patent number 8,736,057
- Issue date May 27, 2014
- Nippon Mining & Metals Co., Ltd.
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless copper plating solution
- Patent number 8,404,035
- Issue date Mar 26, 2013
- Nippon Mining & Metals Co., Ltd.
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated article having metal thin film formed by electroless plating
- Patent number 8,394,508
- Issue date Mar 12, 2013
- Nippon Mining & Metals Co., Ltd.
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated product having copper thin film formed thereon by electroles...
- Patent number 8,283,051
- Issue date Oct 9, 2012
- JX Nippon Mining & Metals Corporation
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate and manufacturing method therefor
- Patent number 8,247,301
- Issue date Aug 21, 2012
- Nippon Mining & Metals Co., Ltd.
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for electroless plating and metal-plated article
- Patent number 8,182,873
- Issue date May 22, 2012
- Nippon Mining & Metals Co., Ltd
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plated article having metal thin film formed by electroless plating...
- Patent number 8,163,400
- Issue date Apr 24, 2012
- Nippon Mining & Metals Co., Ltd
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of surface treatment using imidazole compound
- Patent number 7,968,150
- Issue date Jun 28, 2011
- Nippon Mining & Metals Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal plating method and pretreatment agent
- Patent number 7,867,564
- Issue date Jan 11, 2011
- Nippon Mining & Metals Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroless plating method and semiconductor wafer on which metal p...
- Patent number 7,179,741
- Issue date Feb 20, 2007
- Nikko Materials Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PLATED PRODUCT HAVING COPPER THIN FILM FORMED THEREON BY ELECTROLES...
- Publication number 20110129688
- Publication date Jun 2, 2011
- Junichi Ito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100244258
- Publication date Sep 30, 2010
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20100244259
- Publication date Sep 30, 2010
- Junichi Ito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plated article having metal thin film formed by electroless plating...
- Publication number 20100038111
- Publication date Feb 18, 2010
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plated article having metal thin film formed by electroless plating...
- Publication number 20100003539
- Publication date Jan 7, 2010
- Atsushi Yabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method of surface treatment using imidazole compound
- Publication number 20090068364
- Publication date Mar 12, 2009
- Nikko Materials Co., Ltd.
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming a seed layer for damascene copper wiring, and se...
- Publication number 20080224313
- Publication date Sep 18, 2008
- Atsushi Yabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroless copper plating solution and electroless copper plating...
- Publication number 20070071904
- Publication date Mar 29, 2007
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroless copper plating solution
- Publication number 20070042125
- Publication date Feb 22, 2007
- Atsushi Yabe
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for electroless plating and metal-plated article
- Publication number 20060233963
- Publication date Oct 19, 2006
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Novel imidazole alcohol compound, process for producing the same, a...
- Publication number 20060135584
- Publication date Jun 22, 2006
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for metal plating and pre-treating agent
- Publication number 20050147755
- Publication date Jul 7, 2005
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of electroless plating and semiconductor wafer having metal...
- Publication number 20040235294
- Publication date Nov 25, 2004
- Toru Imori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Atsushi Yabe

Person

Patents Grantslast 30 patents

Substrate and manufacturing method therefor

Electroless copper plating solution

Plated article having metal thin film formed by electroless plating

Plated product having copper thin film formed thereon by electroles...

Substrate and manufacturing method therefor

Method for electroless plating and metal-plated article

Plated article having metal thin film formed by electroless plating...

Method of surface treatment using imidazole compound

Metal plating method and pretreatment agent

Electroless plating method and semiconductor wafer on which metal p...

Patents Applicationslast 30 patents

PLATED PRODUCT HAVING COPPER THIN FILM FORMED THEREON BY ELECTROLES...

SUBSTRATE AND MANUFACTURING METHOD THEREFOR

SUBSTRATE AND MANUFACTURING METHOD THEREFOR

Plated article having metal thin film formed by electroless plating...

Plated article having metal thin film formed by electroless plating...

Method of surface treatment using imidazole compound

Method for forming a seed layer for damascene copper wiring, and se...

Electroless copper plating solution and electroless copper plating...

Electroless copper plating solution

Method for electroless plating and metal-plated article

Novel imidazole alcohol compound, process for producing the same, a...

Method for metal plating and pre-treating agent

Method of electroless plating and semiconductor wafer having metal...