Atsushi Yamashita

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Albany, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for thinning a bonding wafer
- Patent number 8,476,165
- Issue date Jul 2, 2013
- Tokyo Electron Limited
- Douglas M Trickett
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR THINNING A BONDING WAFER
- Publication number 20100255682
- Publication date Oct 7, 2010
- TOKYO ELECTRON LIMITED
- Douglas M. Trickett
- H01 - BASIC ELECTRIC ELEMENTS