Audel A. Sanchez

Person

Tempe, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 12,087,671
- Issue date Sep 10, 2024
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged electronic devices with top terminations
- Patent number 11,343,919
- Issue date May 24, 2022
- NXP USA, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overmolded microelectronic packages containing knurled flanges and...
- Patent number 10,998,255
- Issue date May 4, 2021
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,861,774
- Issue date Dec 8, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Internally-shielded microelectronic packages and methods for the fa...
- Patent number 10,629,518
- Issue date Apr 21, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,529,638
- Issue date Jan 7, 2020
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,396,006
- Issue date Aug 27, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing packaged electronic devices with top termi...
- Patent number 10,375,833
- Issue date Aug 6, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die crack detector and method therefor
- Patent number 10,241,151
- Issue date Mar 26, 2019
- NXP USA, INC.
- Audel Sanchez
- G01 - MEASURING TESTING
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,199,303
- Issue date Feb 5, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded air cavity packages and methods for the production thereof
- Patent number 10,199,302
- Issue date Feb 5, 2019
- NXP USA, INC.
- Audel Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for achieving semiconductor-based circuits or sys...
- Patent number 10,141,227
- Issue date Nov 27, 2018
- NXP USA, INC.
- Jose Luis Suarez
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged electronic devices with top terminations, and methods of m...
- Patent number 9,986,646
- Issue date May 29, 2018
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency devices with surface-mountable capacitors for decou...
- Patent number 9,800,208
- Issue date Oct 24, 2017
- NXP USA, INC.
- Mahesh K. Shah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Die crack detector with integrated one-time programmable element
- Patent number 9,646,897
- Issue date May 9, 2017
- NXP USA, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for multi-chip structure semiconductor package
- Patent number 9,466,588
- Issue date Oct 11, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency devices with surface-mountable capacitors for decou...
- Patent number 9,300,254
- Issue date Mar 29, 2016
- Freescale Semiconductor Inc.
- Mahesh K. Shah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
System, method and apparatus for leadless surface mounted semicondu...
- Patent number 9,263,375
- Issue date Feb 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape release systems and methods for semiconductor dies
- Patent number 9,196,520
- Issue date Nov 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged leadless semiconductor device
- Patent number 9,159,588
- Issue date Oct 13, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for bonding a die and a substrate
- Patent number 9,111,901
- Issue date Aug 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and methods of operation for separating semiconductor die f...
- Patent number 9,111,984
- Issue date Aug 18, 2015
- Freescale Semiconductor Inc.
- Audel A. Sanchez
- B32 - LAYERED PRODUCTS
Information Patent Grant
Semiconductor devices that include a die bonded to a substrate with...
- Patent number 9,105,599
- Issue date Aug 11, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for multi-chip structure semiconductor package
- Patent number 8,963,305
- Issue date Feb 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System, method and apparatus for leadless surface mounted semicondu...
- Patent number 8,803,302
- Issue date Aug 12, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonding a semiconductor device
- Patent number 8,753,983
- Issue date Jun 17, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged leadless semiconductor device
- Patent number 8,698,291
- Issue date Apr 15, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling a semiconductor component and apparatus therefor
- Patent number 7,101,736
- Issue date Sep 5, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...
- Publication number 20210217685
- Publication date Jul 15, 2021
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...
- Publication number 20200211932
- Publication date Jul 2, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...
- Publication number 20200075463
- Publication date Mar 5, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...
- Publication number 20200020614
- Publication date Jan 16, 2020
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING PACKAGED ELECTRONIC DEVICES WITH TOP TERMI...
- Publication number 20190343005
- Publication date Nov 7, 2019
- NXP USA, Inc.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190109060
- Publication date Apr 11, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190051571
- Publication date Feb 14, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190043774
- Publication date Feb 7, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF
- Publication number 20190043775
- Publication date Feb 7, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CRACK DETECTOR AND METHOD THEREFOR
- Publication number 20190033365
- Publication date Jan 31, 2019
- NXP USA, Inc.
- AUDEL SANCHEZ
- G01 - MEASURING TESTING
Information Patent Application
PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...
- Publication number 20180270960
- Publication date Sep 20, 2018
- NXP USA, Inc.
- Lakshminarayan VISWANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...
- Publication number 20160163623
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...
- Publication number 20160164471
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Mahesh K. SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...
- Publication number 20160150632
- Publication date May 26, 2016
- FREESCALE SEMICONDUCTOR, INC.
- LAKSHMINARAYAN VISWANATHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...
- Publication number 20150381117
- Publication date Dec 31, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mahesh K. SHAH
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGED LEADLESS SEMICONDUCTOR DEVICE
- Publication number 20150249021
- Publication date Sep 3, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE
- Publication number 20150171057
- Publication date Jun 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICES AND METHODS OF OPERATION FOR SEPARATING SEMICONDUCTOR DIE F...
- Publication number 20150114572
- Publication date Apr 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CRACK DETECTOR WITH INTEGRATED ONE-TIME PROGRAMMABLE ELEMENT
- Publication number 20150115266
- Publication date Apr 30, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. SANCHEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...
- Publication number 20140332941
- Publication date Nov 13, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR BONDING A DIE AND A SUBSTRATE
- Publication number 20140256091
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- JIN-WOOK JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES THAT INCLUDE A DIE BONDED TO A SUBSTRATE WITH...
- Publication number 20140252586
- Publication date Sep 11, 2014
- FREESCALE SEMICONDUCTOR, INC.
- JIN-WOOK JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE
- Publication number 20140084432
- Publication date Mar 27, 2014
- FREESCALE SEMICONDUCTOR, INC.
- Fernando A. Santos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...
- Publication number 20130320515
- Publication date Dec 5, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED LEADLESS SEMICONDUCTOR DEVICE
- Publication number 20130154068
- Publication date Jun 20, 2013
- FREESCALE SEMICONDUCTOR, INC.
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING A SEMICONDUCTOR DEVICE
- Publication number 20110163439
- Publication date Jul 7, 2011
- Jin-Wook Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling a semiconductor component and apparatus therefor
- Publication number 20060014325
- Publication date Jan 19, 2006
- Audel A. Sanchez
- H01 - BASIC ELECTRIC ELEMENTS

Audel A. Sanchez

Person

Patents Grantslast 30 patents

Overmolded microelectronic packages containing knurled flanges and...

Packaged electronic devices with top terminations

Overmolded microelectronic packages containing knurled flanges and...

Internally-shielded microelectronic packages and methods for the fa...

Internally-shielded microelectronic packages and methods for the fa...

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Methods of manufacturing packaged electronic devices with top termi...

Die crack detector and method therefor

Molded air cavity packages and methods for the production thereof

Molded air cavity packages and methods for the production thereof

Method and system for achieving semiconductor-based circuits or sys...

Packaged electronic devices with top terminations, and methods of m...

Radio frequency devices with surface-mountable capacitors for decou...

Die crack detector with integrated one-time programmable element

Method and apparatus for multi-chip structure semiconductor package

Radio frequency devices with surface-mountable capacitors for decou...

System, method and apparatus for leadless surface mounted semicondu...

Tape release systems and methods for semiconductor dies

Packaged leadless semiconductor device

Methods for bonding a die and a substrate

Devices and methods of operation for separating semiconductor die f...

Semiconductor devices that include a die bonded to a substrate with...

Method and apparatus for multi-chip structure semiconductor package

System, method and apparatus for leadless surface mounted semicondu...

Die bonding a semiconductor device

Packaged leadless semiconductor device

Method of assembling a semiconductor component and apparatus therefor

Patents Applicationslast 30 patents

OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...

INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...

INTERNALLY-SHIELDED MICROELECTRONIC PACKAGES AND METHODS FOR THE FA...

OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND...

METHODS OF MANUFACTURING PACKAGED ELECTRONIC DEVICES WITH TOP TERMI...

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

MOLDED AIR CAVITY PACKAGES AND METHODS FOR THE PRODUCTION THEREOF

DIE CRACK DETECTOR AND METHOD THEREFOR

PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...

SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...

RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...

PACKAGED ELECTRONIC DEVICES WITH TOP TERMINATIONS, AND METHODS OF M...

RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...

PACKAGED LEADLESS SEMICONDUCTOR DEVICE

METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE

DEVICES AND METHODS OF OPERATION FOR SEPARATING SEMICONDUCTOR DIE F...

DIE CRACK DETECTOR WITH INTEGRATED ONE-TIME PROGRAMMABLE ELEMENT

SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...

METHODS FOR BONDING A DIE AND A SUBSTRATE

SEMICONDUCTOR DEVICES THAT INCLUDE A DIE BONDED TO A SUBSTRATE WITH...

METHOD AND APPARATUS FOR MULTI-CHIP STRUCTURE SEMICONDUCTOR PACKAGE

SYSTEM, METHOD AND APPARATUS FOR LEADLESS SURFACE MOUNTED SEMICONDU...

PACKAGED LEADLESS SEMICONDUCTOR DEVICE

DIE BONDING A SEMICONDUCTOR DEVICE

Method of assembling a semiconductor component and apparatus therefor