Avi Dayan

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Jerusalem, IL

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level chip packaging
- Patent number 7,936,062
- Issue date May 3, 2011
- Tessera Technologies Ireland Limited
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Patent number 7,807,508
- Issue date Oct 5, 2010
- Tessera Technologies Hungary Kft
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wafer-level fabrication of lidded chips with electrodeposited diele...
- Publication number 20080099907
- Publication date May 1, 2008
- Tessera Technologies Hungary Kft.
- Vage Oganesian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level chip packaging
- Publication number 20070190691
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Wafer level packaging to lidded chips
- Publication number 20070190747
- Publication date Aug 16, 2007
- Tessera Technologies Hungary Kft.
- Giles Humpston
- B81 - MICRO-STRUCTURAL TECHNOLOGY