Avi Strum

Person

Haifa, IL

People

Patents Grantslast 30 patents

Information Patent Grant
Image sensor module and a method for evaluating an image sensor
- Patent number 10,210,526
- Issue date Feb 19, 2019
- Tower Semiconductor Ltd.
- Yakov Roizin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Image sensor pixel with memory node having buried channel and diode...
- Patent number 9,865,632
- Issue date Jan 9, 2018
- Tower Semiconductor Ltd.
- Assaf Lahav
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor pixel with memory node having buried channel and diode...
- Patent number 9,729,810
- Issue date Aug 8, 2017
- Tower Semiconductor Ltd.
- Assaf Lahav
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Back-end processing using low-moisture content oxide cap layer
- Patent number 9,431,455
- Issue date Aug 30, 2016
- Tower Semiconductor, Ltd.
- Amos Fenigstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-speed compare operation using magnetic tunnel junction element...
- Patent number 9,330,748
- Issue date May 3, 2016
- Tower Semiconductor Ltd.
- Yakov Roizin
- G11 - INFORMATION STORAGE
Information Patent Grant
Logic unit including magnetic tunnel junction elements having two d...
- Patent number 9,331,123
- Issue date May 3, 2016
- Tower Semiconductor Ltd.
- Yakov Roizin
- G11 - INFORMATION STORAGE
Information Patent Grant
Three-dimensional NAND memory with stacked mono-crystalline channels
- Patent number 8,599,616
- Issue date Dec 3, 2013
- Tower Semiconductor Ltd.
- Yakov Roizin
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for generating a three-dimensional NAND memory with mono-cry...
- Patent number 8,501,609
- Issue date Aug 6, 2013
- Tower Semiconductor Ltd.
- Yakov Roizin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-resolution integrated X-ray CMOS image sensor
- Patent number 8,501,573
- Issue date Aug 6, 2013
- Tower Semiconductor Ltd.
- Yakov Roizin
- G01 - MEASURING TESTING
Information Patent Grant
Imager module packaging having top and bottom glass layers
- Patent number 7,807,960
- Issue date Oct 5, 2010
- Samsung Electronics Co., Ltd.
- Avi Strum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High resolution integrated X-ray CMOS image sensor
- Patent number 7,608,837
- Issue date Oct 27, 2009
- Tower Semiconductor Ltd.
- Yakov Roizin
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Image Sensor Pixel With Memory Node Having Buried Channel And Diode...
- Publication number 20170323912
- Publication date Nov 9, 2017
- Tower Semiconductor Ltd.
- Assaf Lahav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR MODULE AND A METHOD FOR EVALUATING AN IMAGE SENSOR
- Publication number 20160307203
- Publication date Oct 20, 2016
- Tower Semiconductor Ltd.
- Yakov Roizin
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Image Sensor Pixel With Memory Node Having Buried Channel And Diode...
- Publication number 20160286151
- Publication date Sep 29, 2016
- Tower Semiconductor Ltd.
- Assaf Lahav
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back-End Processing Using Low-Moisture Content Oxide Cap Layer
- Publication number 20160133666
- Publication date May 12, 2016
- Tower Semiconductor Ltd.
- Amos Fenigstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Logic Unit Including Magnetic Tunnel Junction Elements Having Two D...
- Publication number 20150325624
- Publication date Nov 12, 2015
- Tower Semiconductor Ltd.
- Yakov Roizin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-Speed Compare Operation Using Magnetic Tunnel Junction Element...
- Publication number 20150325279
- Publication date Nov 12, 2015
- Tower Semiconductor Ltd.
- Yakov Roizin
- G11 - INFORMATION STORAGE
Information Patent Application
Method For Generating A Three-Dimensional NAND Memory With Mono-Cry...
- Publication number 20130052803
- Publication date Feb 28, 2013
- Tower Semiconductor Ltd.
- Yakov Roizin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional NAND Memory With Stacked Mono-Crystalline Channels
- Publication number 20130051150
- Publication date Feb 28, 2013
- Tower Semiconductor Ltd.
- Yakov Roizin
- G11 - INFORMATION STORAGE
Information Patent Application
High-Resolution Integrated X-Ray CMOS Image Sensor
- Publication number 20090181491
- Publication date Jul 16, 2009
- Tower Semiconductor Ltd.
- Yakov Roizin
- G01 - MEASURING TESTING
Information Patent Application
Imager module packaging
- Publication number 20090095893
- Publication date Apr 16, 2009
- Avi Strum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Resolution Integrated X-Ray CMOS Image Sensor
- Publication number 20080121808
- Publication date May 29, 2008
- Tower Semiconductor Ltd.
- Yakov Roizin
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Image sensor module and a method for evaluating an image sensor

Image sensor pixel with memory node having buried channel and diode...

Image sensor pixel with memory node having buried channel and diode...

Back-end processing using low-moisture content oxide cap layer

High-speed compare operation using magnetic tunnel junction element...

Logic unit including magnetic tunnel junction elements having two d...

Three-dimensional NAND memory with stacked mono-crystalline channels

Method for generating a three-dimensional NAND memory with mono-cry...

High-resolution integrated X-ray CMOS image sensor

Imager module packaging having top and bottom glass layers

High resolution integrated X-ray CMOS image sensor

Patents Applicationslast 30 patents

Image Sensor Pixel With Memory Node Having Buried Channel And Diode...

IMAGE SENSOR MODULE AND A METHOD FOR EVALUATING AN IMAGE SENSOR

Image Sensor Pixel With Memory Node Having Buried Channel And Diode...

Back-End Processing Using Low-Moisture Content Oxide Cap Layer

Logic Unit Including Magnetic Tunnel Junction Elements Having Two D...

High-Speed Compare Operation Using Magnetic Tunnel Junction Element...

Method For Generating A Three-Dimensional NAND Memory With Mono-Cry...

Three-Dimensional NAND Memory With Stacked Mono-Crystalline Channels

High-Resolution Integrated X-Ray CMOS Image Sensor

Imager module packaging

High Resolution Integrated X-Ray CMOS Image Sensor