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Avinash SHANTARAM
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Whitefish, MT, US
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Patents Grants
last 30 patents
Information
Patent Grant
FOUP or cassette storage for hybrid substrate bonding system
Patent number
11,984,335
Issue date
May 14, 2024
Applied Materials, Inc.
Coby Scott Grove
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modular mainframe layout for supporting multiple semiconductor proc...
Patent number
11,935,771
Issue date
Mar 19, 2024
Applied Materials, Inc.
Randy A. Harris
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Modular mainframe layout for supporting multiple semiconductor proc...
Patent number
11,935,770
Issue date
Mar 19, 2024
Applied Materials, Inc.
Randy A. Harris
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
Publication number
20240194503
Publication date
Jun 13, 2024
Applied Materials, Inc.
Randy A. HARRIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID BONDING OF SEMICONDUCTOR STRUCTURES TO ADVANCED SUBSTRATE PA...
Publication number
20240021571
Publication date
Jan 18, 2024
Anup PANCHOLI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FOUP OR CASSETTE STORAGE FOR HYBRID SUBSTRATE BONDING SYSTEM
Publication number
20230207358
Publication date
Jun 29, 2023
Coby Scott GROVE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
Publication number
20220262653
Publication date
Aug 18, 2022
Randy A. HARRIS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MODULAR MAINFRAME LAYOUT FOR SUPPORTING MULTIPLE SEMICONDUCTOR PROC...
Publication number
20220262652
Publication date
Aug 18, 2022
Randy A. HARRIS
H01 - BASIC ELECTRIC ELEMENTS