Aviv Balan

Person

  • Mountain View, CA, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Multi-stage, multi-zone substrate positioning systems

    • Patent number 11,637,030
    • Issue date Apr 25, 2023
    • KLA Corporation
    • Yoram Uziel
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Slotted electrostatic chuck

    • Patent number 11,121,019
    • Issue date Sep 14, 2021
    • KLA Corporation
    • Aviv Balan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Methods and systems for chucking a warped wafer

    • Patent number 10,468,288
    • Issue date Nov 5, 2019
    • KLA-Tencor Corporation
    • Aviv Balan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Floating wafer chuck

    • Patent number 10,083,852
    • Issue date Sep 25, 2018
    • KLA-Tencor Corporation
    • Aviv Balan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Dual scanning stage

    • Patent number 8,924,014
    • Issue date Dec 30, 2014
    • KLA-Tencor Technologies, Inc.
    • Aviv Balan
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Grant

    Dual scanning stage

    • Patent number 8,285,418
    • Issue date Oct 9, 2012
    • KLA-Tencor Corporation
    • Aviv Balan
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Grant

    Non contact substrate chuck

    • Patent number 7,992,877
    • Issue date Aug 9, 2011
    • KLA-Tencor Corporation
    • Aviv Balan
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

  • Information Patent Application

    Multi-Stage, Multi-Zone Substrate Positioning Systems

    • Publication number 20200402827
    • Publication date Dec 24, 2020
    • KLA Corporation
    • Yoram Uziel
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Slotted Electrostatic Chuck

    • Publication number 20190385882
    • Publication date Dec 19, 2019
    • KLA-Tencor Corporation
    • Aviv Balan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Methods and Systems for Chucking a Warped Wafer

    • Publication number 20180108559
    • Publication date Apr 19, 2018
    • KLA-Tencor Corporation
    • Aviv Balan
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Dual Scanning Stage

    • Publication number 20130073082
    • Publication date Mar 21, 2013
    • KLA-Tencor Corporation
    • Aviv Balan
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Application

    Dual Scanning Stage

    • Publication number 20110022227
    • Publication date Jan 27, 2011
    • KLA-Tencor Corporation
    • Aviv Balan
    • B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
  • Information Patent Application

    Non Contact Substrate Chuck

    • Publication number 20090067114
    • Publication date Mar 12, 2009
    • KLA-Tencor Technologies Corporation
    • Aviv Balan
    • H01 - BASIC ELECTRIC ELEMENTS