Awnish Gupta

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal atomic layer deposition of silicon-containing films
- Patent number 12,157,945
- Issue date Dec 3, 2024
- Lam Research Corporation
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective carbon deposition
- Patent number 12,037,686
- Issue date Jul 16, 2024
- Lam Research Corporation
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of SiN on horizontal surfaces
- Patent number 10,615,169
- Issue date Apr 7, 2020
- Lam Research Corporation
- Bart J. van Schravendijk
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF
- Publication number 20250014890
- Publication date Jan 9, 2025
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMAL SILICON OXIDE DEPOSITION USING AMINOSILANE AND CHLOROSILA...
- Publication number 20240410053
- Publication date Dec 12, 2024
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING
- Publication number 20240387226
- Publication date Nov 21, 2024
- LAM RESEARCH CORPORATION
- Aaron Blake MILLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELECTIVE CARBON DEPOSITION
- Publication number 20240368761
- Publication date Nov 7, 2024
- LAM RESEARCH CORPORATION
- Awnish GUPTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-SITU FILM ANNEALING IN SUBSTRATE PROCESSING
- Publication number 20240167153
- Publication date May 23, 2024
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IMPURITY REDUCTION IN SILICON-CONTAINING FILMS
- Publication number 20230317449
- Publication date Oct 5, 2023
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
REDUCING INTRALEVEL CAPACITANCE IN SEMICONDUCTOR DEVICES
- Publication number 20230307290
- Publication date Sep 28, 2023
- LAM RESEARCH CORPORATION
- Joseph R. ABEL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL THERMAL CVD WITH CONTROLLED FILM PROPERTIES AND HIGH DEPO...
- Publication number 20230245896
- Publication date Aug 3, 2023
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-FEATURE WET ETCH RATE RATIO REDUCTION
- Publication number 20230220544
- Publication date Jul 13, 2023
- LAM RESEARCH CORPORATION
- Awnish Gupta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
NON-PLASMA ENHANCED DEPOSITION FOR RECESS ETCH MATCHING
- Publication number 20230087976
- Publication date Mar 23, 2023
- LAM RESEARCH CORPORATION
- Ian John Curtin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRESSURE BATCH COMPENSATION TO STABILIZE CD VARIATION FOR TRIM AND...
- Publication number 20230002901
- Publication date Jan 5, 2023
- LAM RESEARCH CORPORATION
- Awnish GUPTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RADIO FREQUENCY (RF) POWER IMBALANCING IN A MULTI-STATION INTEGRATE...
- Publication number 20220375721
- Publication date Nov 24, 2022
- LAM RESEARCH CORPORATION
- Jeremy David Fields
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS
- Publication number 20220275510
- Publication date Sep 1, 2022
- LAM RESEARCH CORPORATION
- Awnish GUPTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-SITU CONTROL OF FILM PROPERTIES DURING ATOMIC LAYER DEPOSITION
- Publication number 20220238325
- Publication date Jul 28, 2022
- LAM RESEARCH CORPORATION
- Douglas Walter Agnew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE CARBON DEPOSITION
- Publication number 20220235464
- Publication date Jul 28, 2022
- LAM RESEARCH CORPORATION
- Awnish GUPTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MODIFYING HYDROPHOBICITY OF A WAFER SURFACE USING AN ORGANOSILICON...
- Publication number 20210384029
- Publication date Dec 9, 2021
- LAM RESEARCH CORPORATION
- Jeremy D. Fields
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION OF SiN ON HORIZONTAL SURFACES
- Publication number 20190043876
- Publication date Feb 7, 2019
- LAM RESEARCH CORPORATION
- Bart J. van Schravendijk
- G11 - INFORMATION STORAGE

Awnish Gupta

Person

Patents Grantslast 30 patents

Thermal atomic layer deposition of silicon-containing films

Selective carbon deposition

Selective deposition of SiN on horizontal surfaces

Patents Applicationslast 30 patents

CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF

CONFORMAL SILICON OXIDE DEPOSITION USING AMINOSILANE AND CHLOROSILA...

REMOTE PLASMA DEPOSITION WITH ELECTROSTATIC CLAMPING

SELECTIVE CARBON DEPOSITION

IN-SITU FILM ANNEALING IN SUBSTRATE PROCESSING

IMPURITY REDUCTION IN SILICON-CONTAINING FILMS

REDUCING INTRALEVEL CAPACITANCE IN SEMICONDUCTOR DEVICES

CONFORMAL THERMAL CVD WITH CONTROLLED FILM PROPERTIES AND HIGH DEPO...

IN-FEATURE WET ETCH RATE RATIO REDUCTION

NON-PLASMA ENHANCED DEPOSITION FOR RECESS ETCH MATCHING

PRESSURE BATCH COMPENSATION TO STABILIZE CD VARIATION FOR TRIM AND...

RADIO FREQUENCY (RF) POWER IMBALANCING IN A MULTI-STATION INTEGRATE...

THERMAL ATOMIC LAYER DEPOSITION OF SILICON-CONTAINING FILMS

IN-SITU CONTROL OF FILM PROPERTIES DURING ATOMIC LAYER DEPOSITION

SELECTIVE CARBON DEPOSITION

MODIFYING HYDROPHOBICITY OF A WAFER SURFACE USING AN ORGANOSILICON...

SELECTIVE DEPOSITION OF SiN ON HORIZONTAL SURFACES