Axel Walter

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Radebeul, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a stress buffer material formed abov...
- Patent number 9,324,631
- Issue date Apr 26, 2016
- GLOBALFOUNDIRES INC.
- Axel Walter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device including a stress buffer...
- Patent number 8,450,206
- Issue date May 28, 2013
- GLOBALFOUNDRIES Inc.
- Axel Walter
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER MATERIAL FORMED ABOV...
- Publication number 20130234300
- Publication date Sep 12, 2013
- GLOBALFOUNDRIES INC.
- Axel Walter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A STRESS BUFFER MATERIAL FORMED ABOV...
- Publication number 20110024900
- Publication date Feb 3, 2011
- Axel Walter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
- Publication number 20080099913
- Publication date May 1, 2008
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS