Aya IKEDA

Person

Hitachi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition, method for manufacturing semiconductor device us...
- Patent number 10,808,150
- Issue date Oct 20, 2020
- Hitachi Chemical Company, Ltd.
- Sadaaki Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, resin cured product obtained from adhesive co...
- Patent number 10,358,580
- Issue date Jul 23, 2019
- Hitachi Chemical Company, Ltd.
- Aya Ikeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition, method for manufacturing semiconductor device us...
- Patent number 9,920,227
- Issue date Mar 20, 2018
- Hitachi Chemical Company, Ltd.
- Sadaaki Katou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, method for manufacturing semiconductor device...
- Patent number 9,868,884
- Issue date Jan 16, 2018
- Hitachi Chemical Company, Ltd.
- Aya Ikeda
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CURABLE COMPOSITION FOR FORMING ELASTIC RESIN LAYER
- Publication number 20190241694
- Publication date Aug 8, 2019
- HITACHI CHEMICAL COMPANY, LTD.
- Tomoaki SHIBATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE US...
- Publication number 20180208807
- Publication date Jul 26, 2018
- Hitachi Chemical Company, Ltd.
- Sadaaki KATOU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE US...
- Publication number 20160355709
- Publication date Dec 8, 2016
- Hitachi Chemical Company, Ltd.
- Sadaaki KATOU
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...
- Publication number 20160340561
- Publication date Nov 24, 2016
- Hitachi Chemical Company, Ltd.
- Aya Ikeda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION, RESIN CURED PRODUCT OBTAINED FROM ADHESIVE CO...
- Publication number 20160340554
- Publication date Nov 24, 2016
- Aya IKEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SU...
- Publication number 20120202015
- Publication date Aug 9, 2012
- Aya IKEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Resin composition, method for manufacturing semiconductor device us...

Adhesive composition, resin cured product obtained from adhesive co...

Resin composition, method for manufacturing semiconductor device us...

Adhesive composition, method for manufacturing semiconductor device...

Patents Applicationslast 30 patents

CURABLE COMPOSITION FOR FORMING ELASTIC RESIN LAYER

RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE US...

RESIN COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE US...

ADHESIVE COMPOSITION, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE...

ADHESIVE COMPOSITION, RESIN CURED PRODUCT OBTAINED FROM ADHESIVE CO...

METHOD FOR MANUFACTURING ADHESION BODY, METHOD FOR MANUFACTURING SU...