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Patents Grantslast 30 patents

Information Patent Grant
Bonding structure including metal nano particle
- Patent number 9,362,242
- Issue date Jun 7, 2016
- Mitsubishi Electric Corporation
- Aya Iwata
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE INCLUDING METAL NANO PARTICLES AND BONDING METHOD...
- Publication number 20150041827
- Publication date Feb 12, 2015
- Mitsubishi Electric Corporation
- Aya IWATA
- H01 - BASIC ELECTRIC ELEMENTS