Aya Mizushima

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Production method of suspension board with circuit
- Patent number 8,236,186
- Issue date Aug 7, 2012
- Nitto Denko Corporation
- Aya Mizushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wired circuit board and producing method thereof
- Patent number 7,982,136
- Issue date Jul 19, 2011
- Nitto Denko Corporation
- Aya Mizushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION FOR ELECTRONIC PARTS ENCAPSULATION AND ELEC...
- Publication number 20130148304
- Publication date Jun 13, 2013
- Nitto Denko Corporation
- Yuya KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPOXY RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND...
- Publication number 20130012619
- Publication date Jan 10, 2013
- Nitto Denko Corporation
- Yuya KITAGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production Method of Suspension Board with Circuit
- Publication number 20090261060
- Publication date Oct 22, 2009
- Nitto Denko Corporation
- Aya Mizushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Suspension Board with Circuit and Production Method Thereof
- Publication number 20090255717
- Publication date Oct 15, 2009
- Nitto Denko Corporation
- Aya Mizushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wired circuit board and producing method thereof
- Publication number 20080277147
- Publication date Nov 13, 2008
- Nitto Denko Corporation
- Aya Mizushima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR