Ayako SATO

Person

Niigata, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Resin composition
- Patent number 11,773,301
- Issue date Oct 3, 2023
- Namics Corporation
- Ayako Sato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Resin composition, semiconductor sealing material, one-part adhesiv...
- Patent number 11,518,867
- Issue date Dec 6, 2022
- Namics Corporation
- Masashi Kajita
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Surface-treated silica filler, and resin composition containing sur...
- Patent number 11,072,710
- Issue date Jul 27, 2021
- Namics Corporation
- Ayako Sato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUC...
- Publication number 20240132714
- Publication date Apr 25, 2024
- NAMICS CORPORATION
- Yuki MATSUURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BASE-RELEASING COMPOSITION AND CURABLE RESIN COMPOSITION USING THE...
- Publication number 20230399550
- Publication date Dec 14, 2023
- NAMICS CORPORATION
- Ayako SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOCURABLE RESIN COMPOSITION
- Publication number 20230143754
- Publication date May 11, 2023
- NAMICS CORPORATION
- Ayako SATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
POLYMERIZABLE COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME
- Publication number 20230147645
- Publication date May 11, 2023
- NAMICS CORPORATION
- Ayako SATO
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION
- Publication number 20210380851
- Publication date Dec 9, 2021
- NAMICS CORPORATION
- Ayako SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
RESIN COMPOSITION, SEMICONDUCTOR SEALING MATERIAL, ONE-PART ADHESIV...
- Publication number 20200283599
- Publication date Sep 10, 2020
- Namics Corporation
- Masashi KAJITA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-TREATED SILICA FILLER, AND RESIN COMPOSITION CONTAINING SUR...
- Publication number 20190338138
- Publication date Nov 7, 2019
- Namics Corporation
- Ayako SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Person

Patents Grantslast 30 patents

Resin composition

Resin composition, semiconductor sealing material, one-part adhesiv...

Surface-treated silica filler, and resin composition containing sur...

Patents Applicationslast 30 patents

EPOXY RESIN COMPOSITION, SEMICONDUCTOR DEVICE, AND METHOD OF PRODUC...

BASE-RELEASING COMPOSITION AND CURABLE RESIN COMPOSITION USING THE...

PHOTOCURABLE RESIN COMPOSITION

POLYMERIZABLE COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME

RESIN COMPOSITION

RESIN COMPOSITION, SEMICONDUCTOR SEALING MATERIAL, ONE-PART ADHESIV...

SURFACE-TREATED SILICA FILLER, AND RESIN COMPOSITION CONTAINING SUR...