AYAO NIKI

Person

Ogaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board and method for manufacturing same
- Patent number 9,060,459
- Issue date Jun 16, 2015
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing same
- Patent number 8,959,760
- Issue date Feb 24, 2015
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing substrate with metal film
- Patent number 8,826,530
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board for semiconductor devices and metho...
- Patent number 8,624,121
- Issue date Jan 7, 2014
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate with metal film and method for manufacturing the same
- Patent number 8,563,873
- Issue date Oct 22, 2013
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board having a stiffener
- Patent number 8,237,056
- Issue date Aug 7, 2012
- Ibiden Co., Ltd.
- Ayao Niki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing same
- Patent number 8,238,114
- Issue date Aug 7, 2012
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board for semiconductor devices and metho...
- Patent number 8,085,546
- Issue date Dec 27, 2011
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board for semiconductor devices and metho...
- Patent number 8,027,169
- Issue date Sep 27, 2011
- Ibiden Co., Ltd.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Roll coater for coating and method of manufacturing printed wiring...
- Patent number 6,645,297
- Issue date Nov 11, 2003
- Ibiden Co., Ltd.
- Ayumi Suzuki
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Solder resist composition and printed circuit boards
- Patent number 6,217,987
- Issue date Apr 17, 2001
- Ibiden Co. Ltd.
- Yoshitaka Ono
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20120181072
- Publication date Jul 19, 2012
- IBIDEN CO., LTD.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20110302779
- Publication date Dec 15, 2011
- IBIDEN CO., LTD.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20110296681
- Publication date Dec 8, 2011
- IBIDEN CO., LTD.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20110220399
- Publication date Sep 15, 2011
- IBIDEN CO., LTD.
- AYAO NIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20110085306
- Publication date Apr 14, 2011
- IBIDEN CO., LTD.
- AYAO NIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100243311
- Publication date Sep 30, 2010
- IBIDEN CO., LTD.
- Ayao NIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100243305
- Publication date Sep 30, 2010
- IBIDEN CO., LTD.
- Ayao NIKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRINTED WIRING BOARD HAVING A STIFFENER
- Publication number 20100116529
- Publication date May 13, 2010
- IBIDEN CO., LTD.
- Ayao Niki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20100095523
- Publication date Apr 22, 2010
- IBIDEN CO., LTD.
- AYAO NIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
- Publication number 20090078451
- Publication date Mar 26, 2009
- IBIDEN CO., LTD.
- Ayao Niki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...
- Publication number 20070263370
- Publication date Nov 15, 2007
- IBIDEN CO., LTD.
- AYAO NIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Printed wiring board and method for manufacturing same

Printed wiring board and method for manufacturing same

Method for manufacturing substrate with metal film

Multilayer printed wiring board for semiconductor devices and metho...

Substrate with metal film and method for manufacturing the same

Printed wiring board having a stiffener

Printed wiring board and method for manufacturing same

Multilayer printed wiring board for semiconductor devices and metho...

Multilayer printed wiring board for semiconductor devices and metho...

Roll coater for coating and method of manufacturing printed wiring...

Solder resist composition and printed circuit boards

Patents Applicationslast 30 patents

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...

MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...

SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME

SUBSTRATE WITH METAL FILM AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD HAVING A STIFFENER

MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME

MULTILAYER PRINTED WIRING BOARD FOR SEMICONDUCTOR DEVICES AND METHO...