Ayumi NAKAYAMA

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Chiyoda-ku, Tokyo, JP

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Patents Applicationslast 30 patents

Information Patent Application
MOLDING RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
- Publication number 20240026118
- Publication date Jan 25, 2024
- Resonac Corporation
- Masashi YAMAURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT APPARATUS
- Publication number 20230092703
- Publication date Mar 23, 2023
- Showa Denko Materials Co., Ltd.
- Masashi YAMAURA
- H01 - BASIC ELECTRIC ELEMENTS