Ayumi Okubo

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Osaka, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electroless gold plating method and electronic parts
- Patent number 8,124,174
- Issue date Feb 28, 2012
- C. Uyemura & Co., Ltd.
- Seigo Kurosaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
ELECTROLESS GOLD PLATING METHOD AND ELECTRONIC PARTS
- Publication number 20080277140
- Publication date Nov 13, 2008
- C. Uyemura & Co., Ltd.
- Seigo KUROSAKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...