Ayumu Ozaki

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Producing metal/ceramic circuit board by removing residual silver
- Patent number 10,834,823
- Issue date Nov 10, 2020
- Dowa Metaltech Co., Ltd.
- Takashi Ideno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METAL-CERAMIC BONDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395679
- Publication date Nov 28, 2024
- DOWA METALTECH CO., LTD.
- Ayumu OZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING METAL/CERAMIC CIRCUIT BOARD
- Publication number 20180255645
- Publication date Sep 6, 2018
- DOWA METALTECH CO., LTD.
- Takashi Ideno
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR