Ayumu TATEOKA

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Nantou City, TW

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Patents Grantslast 30 patents

Information Patent Grant
Resin composition, copper foil with resin, and printed wiring board
- Patent number 12,331,212
- Issue date Jun 17, 2025
- Mitsui Mining & Smelting Co., Ltd.
- Kazuhiro Oosawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Roughened copper foil, copper-clad laminate and printed wiring board
- Patent number 12,104,265
- Issue date Oct 1, 2024
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINTED WIRING BOARD
- Publication number 20240175162
- Publication date May 30, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu TATEOKA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ROUGHENED COPPER FOIL, COPPER-CLADDED LAMINATE BOARD, AND PRINTED W...
- Publication number 20240172359
- Publication date May 23, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu TATEOKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION, COPPER FOIL WITH RESIN, AND PRINTED WIRING BOARD
- Publication number 20240101858
- Publication date Mar 28, 2024
- Mitsui Mining and Smelting Co., Ltd.
- Kazuhiro OOSAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...