Ayumu Tateoka

Person

Saitama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Metal foil with releasing resin layer, and printed wiring board
- Patent number 10,863,621
- Issue date Dec 8, 2020
- Mitsui Mining & Smelting Co., Ltd.
- Toshifumi Matsushima
- B32 - LAYERED PRODUCTS
Information Patent Grant
Copper clad laminate provided with protective layer and multilayere...
- Patent number 10,244,640
- Issue date Mar 26, 2019
- Mitsui Mining & Smelting Co., Ltd.
- Fujio Kuwako
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of multilayer printed wiring board
- Patent number 9,585,261
- Issue date Feb 28, 2017
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface-treated copper foil
- Patent number 9,138,964
- Issue date Sep 22, 2015
- Mitsui Mining & Smelting Co., Ltd.
- Shinichi Obata
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method of multilayer printed wiring board
- Patent number 9,066,459
- Issue date Jun 23, 2015
- Mitsui Mining & Smelting Co., Ltd.
- Ayumu Tateoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of preparing electrolytic copper solution acidified with sul...
- Patent number 8,419,920
- Issue date Apr 16, 2013
- Mitsui Mining & Smelting Co., Ltd.
- Sakiko Tomonaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METAL FOIL WITH RELEASING RESIN LAYER, AND PRINTED WIRING BOARD
- Publication number 20170071059
- Publication date Mar 9, 2017
- Mitsui Mining and Smelting Co., Ltd.
- Toshifumi MATSUSHIMA
- B32 - LAYERED PRODUCTS
Information Patent Application
COPPER CLAD LAMINATE PROVIDED WITH PROTECTIVE LAYER AND MULTILAYERE...
- Publication number 20160360624
- Publication date Dec 8, 2016
- Mitsui Mining and Smelting Co., Ltd.
- Fujio KUWAKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20140096381
- Publication date Apr 10, 2014
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu Tateoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...
- Publication number 20140054259
- Publication date Feb 27, 2014
- Mitsui Mining and Smelting Co., Ltd.
- Ayumu Tateoka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE-TREATED COPPER FOIL
- Publication number 20130302635
- Publication date Nov 14, 2013
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi Obata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE-TREATED COPPER FOIL
- Publication number 20130295407
- Publication date Nov 7, 2013
- Mitsui Mining and Smelting Co., Ltd.
- Shinichi Obata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SUL...
- Publication number 20100089758
- Publication date Apr 15, 2010
- Mitsui Mining and Smelting Co., Ltd.
- Sakiko Tomonaga
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSIT...
- Publication number 20090166213
- Publication date Jul 2, 2009
- Mitsui Mining and Smelting Co., Ltd.
- Makoto Dobashi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Ayumu Tateoka

Person

Patents Grantslast 30 patents

Metal foil with releasing resin layer, and printed wiring board

Copper clad laminate provided with protective layer and multilayere...

Manufacturing method of multilayer printed wiring board

Surface-treated copper foil

Manufacturing method of multilayer printed wiring board

Method of preparing electrolytic copper solution acidified with sul...

Patents Applicationslast 30 patents

METAL FOIL WITH RELEASING RESIN LAYER, AND PRINTED WIRING BOARD

COPPER CLAD LAMINATE PROVIDED WITH PROTECTIVE LAYER AND MULTILAYERE...

MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...

MANUFACTURING METHOD OF MULTILAYER PRINTED WIRING BOARD AND MULTILA...

SURFACE-TREATED COPPER FOIL

SURFACE-TREATED COPPER FOIL

METHOD OF PREPARING ELECTROLYTIC COPPER SOLUTION ACIDIFIED WITH SUL...

PRODUCTION METHOD OF ELECTRO-DEPOSITED COPPER FOIL, ELECTRO-DEPOSIT...