Aziz M. Ahsan

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Hopewell Junction, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Method of forming dual height solder interconnections
- Patent number 5,251,806
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mass having conductive encapsulating arrangement
- Patent number 5,130,779
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS