Azlina KASSIM

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 12,080,625
- Issue date Sep 3, 2024
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three level interconnect clip
- Patent number 12,057,376
- Issue date Aug 6, 2024
- Infineon Technologies AG
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with releasable isolation layer protection
- Patent number 11,791,238
- Issue date Oct 17, 2023
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with space efficient lead and die pad design
- Patent number 11,069,600
- Issue date Jul 20, 2021
- Infineon Technologies AG
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe, semiconductor package including a leadframe and method f...
- Patent number 10,840,172
- Issue date Nov 17, 2020
- Infineon Technologies AG
- Thomas Bemmerl
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...
- Publication number 20240312936
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Joon Shyan Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Releasable Isolation Layer Protection
- Publication number 20230395462
- Publication date Dec 7, 2023
- Infineon Technologies Austria AG
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...
- Publication number 20230298956
- Publication date Sep 21, 2023
- INFINEON TECHNOLOGIES AG
- Chii Shang HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Releasable Isolation Layer Protection
- Publication number 20220415753
- Publication date Dec 29, 2022
- Li Fong Chong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three Level Interconnect Clip
- Publication number 20220139811
- Publication date May 5, 2022
- Azlina Kassim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Space Efficient Lead and Die Pad Design
- Publication number 20200373228
- Publication date Nov 26, 2020
- Ke Yan Tean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME, SEMICONDUCTOR PACKAGE INCLUDING A LEADFRAME AND METHOD F...
- Publication number 20180233438
- Publication date Aug 16, 2018
- INFINEON TECHNOLOGIES AG
- Thomas BEMMERL
- H01 - BASIC ELECTRIC ELEMENTS

Azlina KASSIM

Person

Patents Grantslast 30 patents

Semiconductor package with releasable isolation layer protection

Three level interconnect clip

Semiconductor package with releasable isolation layer protection

Semiconductor package with space efficient lead and die pad design

Leadframe, semiconductor package including a leadframe and method f...

Patents Applicationslast 30 patents

POWER SEMICONDUCTOR PACKAGE INCLUDING A PASSIVE ELECTRONIC COMPONEN...

Semiconductor Package with Releasable Isolation Layer Protection

SEMICONDUCTOR PACKAGES INCLUDING A PACKAGE BODY WITH GROOVES FORMED...

Semiconductor Package with Releasable Isolation Layer Protection

Three Level Interconnect Clip

Semiconductor Package with Space Efficient Lead and Die Pad Design

LEADFRAME, SEMICONDUCTOR PACKAGE INCLUDING A LEADFRAME AND METHOD F...