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Azumi Kondo
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Ota-ku, JP
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Patents Grants
last 30 patents
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Patent Grant
Adhesive tape attaching method
Patent number
7,875,148
Issue date
Jan 25, 2011
Disco Corporation
Azumi Kondo
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
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Patent Grant
Wafer processing method
Patent number
7,858,496
Issue date
Dec 28, 2010
Disco Corporation
Keiichi Kajiyama
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
WAFER PROCESSING METHOD
Publication number
20100055877
Publication date
Mar 4, 2010
Disco Corporation
Keiichi Kajiyama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ADHESIVE TAPE ATTACHING METHOD
Publication number
20100000654
Publication date
Jan 7, 2010
Disco Corporation
Azumi Kondo
H01 - BASIC ELECTRIC ELEMENTS