B. Leo Kwak

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Beaverton, OR, US

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Patents Grantslast 30 patents

Information Patent Grant
Adhesion and/or encapsulation of silicon carbide-based semiconducto...
- Patent number 7,352,045
- Issue date Apr 1, 2008
- Microsemi Corporation
- James D. Parsons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion and/or encapsulation of silicon carbide-based semiconducto...
- Patent number 6,911,714
- Issue date Jun 28, 2005
- Advanced Power Technology, Inc.
- James D. Parsons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion and/or encapsulation of silicon carbide-based semiconducto...
- Patent number 6,319,757
- Issue date Nov 20, 2001
- Caldus Semiconductor, Inc.
- James D. Parsons
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Adhesion and/or encapsulation of silicon carbide-based semiconducto...
- Publication number 20050285117
- Publication date Dec 29, 2005
- ADVANCED POWER TECHNOLOGY, INC., a Delaware corporation
- James D. Parsons
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion and/or encapsulation of silicon carbide-based semiconducto...
- Publication number 20020066903
- Publication date Jun 6, 2002
- Caldus Semiconductor, Inc., Oregon corporation
- James D. Parsons
- H01 - BASIC ELECTRIC ELEMENTS