Baek Soung Park

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Core-shell dye, near-infrared absorbing composition including the s...
- Patent number 12,091,553
- Issue date Sep 17, 2024
- Samsung SDI Co., Ltd.
- Insub Shin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Dicing die-bonding film and method of forming a cut on the dicing d...
- Patent number 9,287,217
- Issue date Mar 15, 2016
- Cheil Industries, Inc.
- Baek Soung Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive film for heat dissipation, semiconductor device including...
- Patent number 9,240,364
- Issue date Jan 19, 2016
- Cheil Industries, Inc.
- Baek Soung Park
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Optically clear adhesive for dicing die bonding film
- Patent number 9,133,367
- Issue date Sep 15, 2015
- Cheil Industries, Inc.
- Kyoung Jin Ha
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition for semiconductor and adhesive film comprising...
- Patent number 9,109,147
- Issue date Aug 18, 2015
- Cheil Industries, Inc.
- Baek Soung Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition for semiconductors, adhesive film prepared usi...
- Patent number 8,946,343
- Issue date Feb 3, 2015
- Cheil Industries, Inc.
- Baek Soung Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240361689
- Publication date Oct 31, 2024
- Samsung SDI Co., Ltd.
- Heejo MOON
- C07 - ORGANIC CHEMISTRY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240337924
- Publication date Oct 10, 2024
- Samsung SDI Co., Ltd.
- Junghwa LEE
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240337932
- Publication date Oct 10, 2024
- Samsung SDI Co., Ltd.
- Heejo MOON
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240329526
- Publication date Oct 3, 2024
- Samsung SDI Co., Ltd.
- Eunbi PARK
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240240024
- Publication date Jul 18, 2024
- Samsung SDI Co., Ltd.
- Heejo MOON
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CORE-SHELL DYE, NEAR-INFRARED ABSORBING COMPOSITION INCLUDING THE S...
- Publication number 20240199883
- Publication date Jun 20, 2024
- Samsung SDI Co., Ltd.
- Euisoo JEONG
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240176232
- Publication date May 30, 2024
- Samsung SDI Co., Ltd.
- Chang-Hyun KWON
- G02 - OPTICS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240176233
- Publication date May 30, 2024
- Samsung SDI Co., Ltd.
- Chang-Hyun KWON
- G02 - OPTICS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240168377
- Publication date May 23, 2024
- Samsung SDI Co., Ltd.
- Chang-Hyun KWON
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240103366
- Publication date Mar 28, 2024
- SAMSUNG SDI CO., LTD.
- Jihong KIM
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20240094631
- Publication date Mar 21, 2024
- Samsung SDI Co., Ltd.
- Ieju KIM
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING SAME, PHOTOSE...
- Publication number 20230374312
- Publication date Nov 23, 2023
- Samsung SDI Co., Ltd.
- Chang-Hyun KWON
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CORE-SHELL DYE, NEAR-INFRARED ABSORBING COMPOSITION INCLUDING THE S...
- Publication number 20230348724
- Publication date Nov 2, 2023
- Samsung SDI Co., Ltd.
- Insub SHIN
- G02 - OPTICS
Information Patent Application
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...
- Publication number 20230185190
- Publication date Jun 15, 2023
- Samsung SDI Co., Ltd.
- Baek Soung PARK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CORE-SHELL DYE, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE SAME...
- Publication number 20230136349
- Publication date May 4, 2023
- Samsung SDI Co., Ltd.
- Yeji YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE SAME, COLO...
- Publication number 20230112667
- Publication date Apr 13, 2023
- Samsung SDI Co., Ltd.
- Yeji YANG
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
CORE-SHELL COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE...
- Publication number 20230002618
- Publication date Jan 5, 2023
- Samsung SDI Co., Ltd.
- Ieju KIM
- C07 - ORGANIC CHEMISTRY
Information Patent Application
ADHESIVE FILM FOR HEAT DISSIPATION, SEMICONDUCTOR DEVICE INCLUDING...
- Publication number 20140353848
- Publication date Dec 4, 2014
- Baek Soung PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DICING DIE-BONDING FILM AND METHOD OF FORMING A CUT ON THE DICING D...
- Publication number 20140306357
- Publication date Oct 16, 2014
- Baek Soung PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING...
- Publication number 20140194555
- Publication date Jul 10, 2014
- Jun Woo LEE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING...
- Publication number 20130281559
- Publication date Oct 24, 2013
- Baek Soung Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE COMPOSITION FOR SEMICONDUCTORS, ADHESIVE FILM PREPARED USI...
- Publication number 20130041088
- Publication date Feb 14, 2013
- Baek Soung PARK
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
OPTICALLY CLEAR ADHESIVE FOR DICING DIE BONDING FILM
- Publication number 20120171481
- Publication date Jul 5, 2012
- Kyoung Jin Ha
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIE-ATTACH FILM AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110159223
- Publication date Jun 30, 2011
- Baek Soung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Photocurable composition for the formation of pressure-sensitive ad...
- Publication number 20090075008
- Publication date Mar 19, 2009
- Yong Ha Hwang
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Baek Soung Park

Person

Patents Grantslast 30 patents

Core-shell dye, near-infrared absorbing composition including the s...

Dicing die-bonding film and method of forming a cut on the dicing d...

Adhesive film for heat dissipation, semiconductor device including...

Optically clear adhesive for dicing die bonding film

Adhesive composition for semiconductor and adhesive film comprising...

Adhesive composition for semiconductors, adhesive film prepared usi...

Patents Applicationslast 30 patents

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

CORE-SHELL DYE, NEAR-INFRARED ABSORBING COMPOSITION INCLUDING THE S...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING SAME, PHOTOSE...

CORE-SHELL DYE, NEAR-INFRARED ABSORBING COMPOSITION INCLUDING THE S...

PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER USING...

CORE-SHELL DYE, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE SAME...

COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE SAME, COLO...

CORE-SHELL COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION INCLUDING THE...

ADHESIVE FILM FOR HEAT DISSIPATION, SEMICONDUCTOR DEVICE INCLUDING...

DICING DIE-BONDING FILM AND METHOD OF FORMING A CUT ON THE DICING D...

ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING...

ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING...

ADHESIVE COMPOSITION FOR SEMICONDUCTORS, ADHESIVE FILM PREPARED USI...

OPTICALLY CLEAR ADHESIVE FOR DICING DIE BONDING FILM

DIE-ATTACH FILM AND METHOD OF MANUFACTURING THE SAME

Photocurable composition for the formation of pressure-sensitive ad...