BaeYong Kim

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Seoul, KR

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Patents Grantslast 30 patents

Information Patent Grant
Electronic system with vertical intermetallic compound
- Patent number 8,709,934
- Issue date Apr 29, 2014
- Stats Chippac Ltd.
- BaeYong Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mock bump system for flip chip integrated circuits
- Patent number 8,633,586
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mock bump system for flip chip integrated circuits
- Patent number 8,624,402
- Issue date Jan 7, 2014
- Stats Chippac Ltd.
- YoungMin Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having High-Density Interconnect Array with Co...
- Publication number 20140159236
- Publication date Jun 12, 2014
- STATS ChipPAC, Ltd.
- BaeYong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOCK BUMP SYSTEM FOR FLIP CHIP INTEGRATED CIRCUITS
- Publication number 20090243090
- Publication date Oct 1, 2009
- YoungMin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOCK BUMP SYSTEM FOR FLIP CHIP INTEGRATED CIRCUITS
- Publication number 20090243091
- Publication date Oct 1, 2009
- Oh Han Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Having High-Density Interconnect Array with Co...
- Publication number 20090233436
- Publication date Sep 17, 2009
- STATS ChipPAC, Ltd.
- BaeYong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEM WITH VERTICAL INTERMETALLIC COMPOUND
- Publication number 20080303142
- Publication date Dec 11, 2008
- BaeYong Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...