Bahgat G. Sammakia

Person

Johnson City, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for using pulsating flow to improve thermal transport in sys...
- Patent number 6,219,234
- Issue date Apr 17, 2001
- International Business Corporation
- Bahgat G. Sammakia
- F26 - DRYING
Information Patent Grant
Electronic packages and a method to improve thermal performance of...
- Patent number 6,058,015
- Issue date May 2, 2000
- International Business Machines Corp.
- Bahgat Ghaleb Sammakia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages and a method to improve thermal performance of...
- Patent number 5,966,290
- Issue date Oct 12, 1999
- Internatioinal Business Machines Corporation
- Bahgat Ghaleb Sammakia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages and method to enhance the passive thermal manag...
- Patent number 5,912,800
- Issue date Jun 15, 1999
- International Business Machines Corporation
- Bahgat Ghaleb Sammakia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly mounting techniques for heat sinks in electronic packaging
- Patent number 5,870,285
- Issue date Feb 9, 1999
- International Business Machines Corporation
- Stephen John Kosteva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package having active means to maintain its operating te...
- Patent number 5,491,610
- Issue date Feb 13, 1996
- International Business Machines Corporation
- Lawrence S.-W. Mok
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for testing of integrated circuit chips
- Patent number 5,420,520
- Issue date May 30, 1995
- International Business Machines Corporation
- Morris Anschel
- G01 - MEASURING TESTING
Information Patent Grant
Pluggable electronic circuit package assembly with snap together he...
- Patent number 5,109,318
- Issue date Apr 28, 1992
- International Business Machines Corporation
- Joseph Funari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epoxy composition and use thereof
- Patent number 5,028,984
- Issue date Jul 2, 1991
- International Business Machines Corporation
- Joseph G. Ameen
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Electronic assembly with enhanced heat sinking
- Patent number 5,003,429
- Issue date Mar 26, 1991
- International Business Machines Corporation
- Don L. Baker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package with heat spreader member
- Patent number 4,914,551
- Issue date Apr 3, 1990
- International Business Machines Corporation
- Morris Anschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with improved heat sink
- Patent number 4,849,856
- Issue date Jul 18, 1989
- International Business Machines Corp.
- Joseph Funari
- H01 - BASIC ELECTRIC ELEMENTS

Bahgat G. Sammakia

Person

Patents Grantslast 30 patents

Method for using pulsating flow to improve thermal transport in sys...

Electronic packages and a method to improve thermal performance of...

Electronic packages and a method to improve thermal performance of...

Electronic packages and method to enhance the passive thermal manag...

Assembly mounting techniques for heat sinks in electronic packaging

Electronic package having active means to maintain its operating te...

Method and apparatus for testing of integrated circuit chips

Pluggable electronic circuit package assembly with snap together he...

Epoxy composition and use thereof

Electronic assembly with enhanced heat sinking

Electronic package with heat spreader member

Electronic package with improved heat sink