Bai NIE

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
- Patent number 11,929,330
- Issue date Mar 12, 2024
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,923,307
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with variable height conductive and dielectric elements
- Patent number 11,837,534
- Issue date Dec 5, 2023
- Intel Corporation
- Aleksandar Aleksov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid fine line spacing architecture for bump pitch scaling
- Patent number 11,694,898
- Issue date Jul 4, 2023
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic structures including bridges
- Patent number 11,521,931
- Issue date Dec 6, 2022
- Intel Corporation
- Jason M. Gamba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithographic cavity formation to enable EMIB bump pitch scaling
- Patent number 11,322,444
- Issue date May 3, 2022
- Intel Corporation
- Kristof Darmawikarta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTR...
- Publication number 20250096052
- Publication date Mar 20, 2025
- Intel Corporation
- Mohamed R. Saber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES
- Publication number 20250022786
- Publication date Jan 16, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH INTEGRATED GLASS-BASED ANTENNA UNITS
- Publication number 20240363995
- Publication date Oct 31, 2024
- Intel Corporation
- Bai Nie
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE
- Publication number 20240329333
- Publication date Oct 3, 2024
- Intel Corporation
- Robert May
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
2D FILLERS FOR REDUCED CTE FOR PID
- Publication number 20240332125
- Publication date Oct 3, 2024
- Intel Corporation
- Kyle ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...
- Publication number 20240312865
- Publication date Sep 19, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING
- Publication number 20240243066
- Publication date Jul 18, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES
- Publication number 20240219629
- Publication date Jul 4, 2024
- Intel Corporation
- Changhua Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219659
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING
- Publication number 20240222345
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...
- Publication number 20240222243
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219655
- Publication date Jul 4, 2024
- Intel Corporation
- Haobo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219660
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- G02 - OPTICS
Information Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
- Publication number 20240222301
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...
- Publication number 20240222304
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL LAYER WITH ROUGHENED SURFACES
- Publication number 20240222136
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES
- Publication number 20240222257
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219654
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL SEMICONDUCTOR PACKAGE AND METHOD
- Publication number 20240219656
- Publication date Jul 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES
- Publication number 20240222283
- Publication date Jul 4, 2024
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE FABRICATION USING HYBRID BONDING
- Publication number 20240222210
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO RE...
- Publication number 20240222238
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS
- Publication number 20240213170
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY
- Publication number 20240215269
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...
- Publication number 20240213116
- Publication date Jun 27, 2024
- Intel Corporation
- Kyle Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD
- Publication number 20240213169
- Publication date Jun 27, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA
- Publication number 20240203806
- Publication date Jun 20, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY FILM PHOTORESIST WET LAMINATION AND METHOD
- Publication number 20240203853
- Publication date Jun 20, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGE SUBSTRATE WITH VERTICAL OPTICAL...
- Publication number 20240192453
- Publication date Jun 13, 2024
- Intel Corporation
- Changhua Liu
- G02 - OPTICS
Information Patent Application
LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS
- Publication number 20240184209
- Publication date Jun 6, 2024
- Intel Corporation
- Changhua LIU
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Person

Patents Grantslast 30 patents

Lithographic cavity formation to enable EMIB bump pitch scaling

Microelectronic structures including bridges

Patternable die attach materials and processes for patterning

Substrate with variable height conductive and dielectric elements

Hybrid fine line spacing architecture for bump pitch scaling

Microelectronic structures including bridges

Lithographic cavity formation to enable EMIB bump pitch scaling

Patents Applicationslast 30 patents

LOCALIZED THERMAL HEALING AND DOPING OF GLASS CORES FOR MICROELECTR...

METHODS AND APPARATUS FOR EDGE PROTECTED GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH INTEGRATED GLASS-BASED ANTENNA UNITS

CO-PACKAGING OF PHOTONIC & ELECTRONIC INTEGRATED CIRCUIT DIE

2D FILLERS FOR REDUCED CTE FOR PID

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO IMPROVE...

LITHOGRAPHIC CAVITY FORMATION TO ENABLE EMIB BUMP PITCH SCALING

PHOTONIC INTEGRATED CIRCUITS WITH GLASS CORES

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

DIE ATTACH IN GLASS CORE PACKAGE THROUGH ORGANIC-TO-ORGANIC BONDING

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING HYBRI...

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...

METHODS AND APPARATUS TO REDUCE SOLDER BUMP BRIDGING BETWEEN TWO SU...

ELECTRICAL LAYER WITH ROUGHENED SURFACES

GLASS SUBSTRATE DEVICE WITH PLATED THROUGH HOLES

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

OPTICAL SEMICONDUCTOR PACKAGE AND METHOD

METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES

GLASS SUBSTRATE FABRICATION USING HYBRID BONDING

APPARATUS AND METHOD FOR ATTACHING AN OPTICAL COMPONENT USING NO RE...

GLASS SUBSTRATE DEVICE WITH EMBEDDED COMPONENTS

GLASS SUBSTRATE DEVICE WITH THROUGH GLASS CAVITY

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO COOL IN...

LOW DIE HEIGHT GLASS SUBSTRATE DEVICE AND METHOD

GLASS LAYER WITH LITHO DEFINED THROUGH-GLASS VIA

DRY FILM PHOTORESIST WET LAMINATION AND METHOD

PHOTONIC INTEGRATED CIRCUIT PACKAGE SUBSTRATE WITH VERTICAL OPTICAL...

LITHOGRAPHIC PROCESSES FOR MAKING POLYMER-BASED ELEMENTS