Baik Woo Lee

Person

Issaquah, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Direct chip-on-array for a multidimensional transducer array
- Patent number 11,965,961
- Issue date Apr 23, 2024
- Siemens Medical Solutions USA, Inc.
- Baik Woo Lee
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Direct chip-on-array for a multidimensional transducer array
- Patent number 11,656,355
- Issue date May 23, 2023
- Siemens Medical Solutions USA, Inc.
- Baik Woo Lee
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Chip-on-array with interposer for a multidimensional transducer array
- Patent number 11,498,096
- Issue date Nov 15, 2022
- Siemens Medical Solutions USA, Inc.
- Baik Woo Lee
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Ultrasound transducer and manufacturing method thereof
- Patent number 11,101,424
- Issue date Aug 24, 2021
- Siemens Medical Solutions USA, Inc.
- KyungHo Lee
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Patents Applicationslast 30 patents

Information Patent Application
CONNECTION FOR A MULTI-DIMENSIONAL MATRIX TRANSDUCER
- Publication number 20240215951
- Publication date Jul 4, 2024
- Siemens Medical Solutions USA, Inc.
- Baik Woo Lee
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
DIRECT CHIP-ON-ARRAY FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY
- Publication number 20230251376
- Publication date Aug 10, 2023
- Siemens Medical Solutions USA, Inc.
- Baik Woo Lee
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
CHIP-ON-ARRAY WITH INTERPOSER FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY
- Publication number 20230066356
- Publication date Mar 2, 2023
- Siemens Medical Solutions USA, Inc.
- Baik Woo Lee
- G01 - MEASURING TESTING
Information Patent Application
DIRECT CHIP-ON-ARRAY FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY
- Publication number 20220018957
- Publication date Jan 20, 2022
- Siemens Medical Solutions USA, Inc.
- Baik Woo Lee
- G01 - MEASURING TESTING
Information Patent Application
Interposer for an Ultrasound Transducer Array
- Publication number 20210138506
- Publication date May 13, 2021
- Siemens Medical Solutions USA, Inc.
- Baik Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-ARRAY WITH INTERPOSER FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY
- Publication number 20200009615
- Publication date Jan 9, 2020
- Siemens Medical Solutions USA, Inc.
- Baik Woo Lee
- G01 - MEASURING TESTING
Information Patent Application
Ultrasound Transducer and Manufacturing Method Thereof
- Publication number 20190088849
- Publication date Mar 21, 2019
- Siemens Medical Solutions USA, Inc.
- KyungHo Lee
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL

Baik Woo Lee

Person

Patents Grantslast 30 patents

Direct chip-on-array for a multidimensional transducer array

Direct chip-on-array for a multidimensional transducer array

Chip-on-array with interposer for a multidimensional transducer array

Ultrasound transducer and manufacturing method thereof

Patents Applicationslast 30 patents

CONNECTION FOR A MULTI-DIMENSIONAL MATRIX TRANSDUCER

DIRECT CHIP-ON-ARRAY FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY

CHIP-ON-ARRAY WITH INTERPOSER FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY

DIRECT CHIP-ON-ARRAY FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY

Interposer for an Ultrasound Transducer Array

CHIP-ON-ARRAY WITH INTERPOSER FOR A MULTIDIMENSIONAL TRANSDUCER ARRAY

Ultrasound Transducer and Manufacturing Method Thereof