Baik-woo LEE

Person

Gwangmyeong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Magneto-resistive chip package including shielding structure
- Patent number 10,923,650
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Jae-gwon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive chip package including shielding structure
- Patent number 10,074,799
- Issue date Sep 11, 2018
- Samsung Electronics Co., Ltd.
- Jae-gwon Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,893,020
- Issue date Feb 13, 2018
- Samsung Electronics Co., Ltd.
- Baik-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and semiconductor packages including the same
- Patent number 9,775,230
- Issue date Sep 26, 2017
- Samsung Electronics Co., Ltd.
- Young-jae Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 9,627,327
- Issue date Apr 18, 2017
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Semiconductor device package including bonding layer having Ag3Sn
- Patent number 9,520,377
- Issue date Dec 13, 2016
- Samsung Electronics Co., Ltd.
- Jeong-Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 9,431,374
- Issue date Aug 30, 2016
- Samsung Electronics Co., Ltd.
- Baik-Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor devices
- Patent number 9,087,833
- Issue date Jul 21, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nitride semiconductor based power converting device
- Patent number 9,082,693
- Issue date Jul 14, 2015
- Samsung Electronics Co., Ltd.
- Woo-chul Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power device and power device module
- Patent number 8,963,325
- Issue date Feb 24, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer laminate package and method of manufacturing the same
- Patent number 8,872,041
- Issue date Oct 28, 2014
- Samsung Electronics Co., Ltd.
- Baik-Woo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Folded stacked package and method of manufacturing the same
- Patent number 8,861,205
- Issue date Oct 14, 2014
- Samsung Electronics Co., Ltd.
- Baik-Woo Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MAGNETO-RESISTIVE CHIP PACKAGE INCLUDING SHIELDING STRUCTURE
- Publication number 20180375017
- Publication date Dec 27, 2018
- Samsung Electronics Co., Ltd.
- Jae-gwon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE ELEMENT PACKAGE AND SEMICONDUCTOR MODULE COMPRISING THE SAME
- Publication number 20170294407
- Publication date Oct 12, 2017
- Samsung Electronics Co., Ltd.
- YOUNG-JAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170069828
- Publication date Mar 9, 2017
- Samsung Electronics Co., Ltd.
- Baik-Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
- Publication number 20170064824
- Publication date Mar 2, 2017
- Samsung Electronics Co., Ltd.
- Young-jae KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETO-RESISTIVE CHIP PACKAGE INCLUDING SHIELDING STRUCTURE
- Publication number 20160322562
- Publication date Nov 3, 2016
- Jae-gwon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING ELECTROMAG...
- Publication number 20160276288
- Publication date Sep 22, 2016
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160099218
- Publication date Apr 7, 2016
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20160071831
- Publication date Mar 10, 2016
- Baik-Woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20150115452
- Publication date Apr 30, 2015
- Samsung Electronics Co., Ltd.
- Jeong-Won YOON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER SEMICONDUCTOR MODULE
- Publication number 20150001726
- Publication date Jan 1, 2015
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICES
- Publication number 20140151744
- Publication date Jun 5, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NITRIDE SEMICONDUCTOR BASED POWER CONVERTING DEVICE
- Publication number 20140091311
- Publication date Apr 3, 2014
- Woo-chul JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER DEVICE AND POWER DEVICE MODULE
- Publication number 20140021620
- Publication date Jan 23, 2014
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130026655
- Publication date Jan 31, 2013
- Samsung Electronics Co., Ltd.
- Baik-woo LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDED STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120170231
- Publication date Jul 5, 2012
- Samsung Electronics Co., Ltd.
- Baik-Woo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER LAMINATE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120024583
- Publication date Feb 2, 2012
- Samsung Electronics Co., Ltd.
- Baik-Woo LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Baik-woo LEE

Person

Patents Grantslast 30 patents

Magneto-resistive chip package including shielding structure

Magneto-resistive chip package including shielding structure

Semiconductor device

Printed circuit board and semiconductor packages including the same

Semiconductor package and method of manufacturing the same

Semiconductor device package including bonding layer having Ag3Sn

Semiconductor package

Power semiconductor devices

Nitride semiconductor based power converting device

Power device and power device module

Multilayer laminate package and method of manufacturing the same

Folded stacked package and method of manufacturing the same

Patents Applicationslast 30 patents

MAGNETO-RESISTIVE CHIP PACKAGE INCLUDING SHIELDING STRUCTURE

PASSIVE ELEMENT PACKAGE AND SEMICONDUCTOR MODULE COMPRISING THE SAME

SEMICONDUCTOR DEVICE

PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME

MAGNETO-RESISTIVE CHIP PACKAGE INCLUDING SHIELDING STRUCTURE

SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING ELECTROMAG...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME

POWER SEMICONDUCTOR MODULE

POWER SEMICONDUCTOR DEVICES

NITRIDE SEMICONDUCTOR BASED POWER CONVERTING DEVICE

POWER DEVICE AND POWER DEVICE MODULE

CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

FOLDED STACKED PACKAGE AND METHOD OF MANUFACTURING THE SAME

MULTILAYER LAMINATE PACKAGE AND METHOD OF MANUFACTURING THE SAME