Bainian Qian

Person

Newark, DE, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chemical mechanical polishing pad and preparation thereof
- Patent number 12,220,784
- Issue date Feb 11, 2025
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad and preparation thereof
- Patent number 11,679,531
- Issue date Jun 20, 2023
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Methods of making chemical mechanical polishing layers having impro...
- Patent number 11,524,390
- Issue date Dec 13, 2022
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad
- Patent number 11,396,081
- Issue date Jul 26, 2022
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad
- Patent number 10,875,144
- Issue date Dec 29, 2020
- Rohm and Haas Electronic Materials CMP Holdings, I
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
High removal rate chemical mechanical polishing pads and methods of...
- Patent number 10,722,999
- Issue date Jul 28, 2020
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Thomas P. Willumstad
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Chemical mechanical polishing pads having offset circumferential gr...
- Patent number 10,625,393
- Issue date Apr 21, 2020
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
High removal rate chemical mechanical polishing pads from amine ini...
- Patent number 10,464,187
- Issue date Nov 5, 2019
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pads for improved removal rate and pl...
- Patent number 10,391,606
- Issue date Aug 27, 2019
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Jonathan G. Weis
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making polishing layer for chemical mechanical polishing pad
- Patent number 10,144,115
- Issue date Dec 4, 2018
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- David Michael Veneziale
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making polishing layer for chemical mechanical polishing pad
- Patent number 10,105,825
- Issue date Oct 23, 2018
- Rohm and Haas Electronics Materials CMP Holdings, Inc.
- David Michael Veneziale
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making composite polishing layer for chemical mechanical...
- Patent number 10,092,998
- Issue date Oct 9, 2018
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making composite polishing layer for chemical mechanical...
- Patent number 10,011,002
- Issue date Jul 3, 2018
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad and method of making same
- Patent number 9,776,300
- Issue date Oct 3, 2017
- Rohm and Haas Electronic Materials CMP Holdings Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad composite polishing layer formula...
- Patent number 9,630,293
- Issue date Apr 25, 2017
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Chemical mechanical polishing pad and method of making same
- Patent number 9,586,305
- Issue date Mar 7, 2017
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Controlled-expansion CMP PAD casting method
- Patent number 9,586,304
- Issue date Mar 7, 2017
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Composite polishing layer chemical mechanical polishing pad
- Patent number 9,539,694
- Issue date Jan 10, 2017
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Julia Kozhukh
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High-stability polyurethane polishing pad
- Patent number 9,481,070
- Issue date Nov 1, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing method
- Patent number 9,484,212
- Issue date Nov 1, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad window
- Patent number 9,475,168
- Issue date Oct 25, 2016
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad with composite polishing layer
- Patent number 9,457,449
- Issue date Oct 4, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Teresa Brugarolas Brufau
- B24 - GRINDING POLISHING
Information Patent Grant
Controlled-viscosity CMP casting method
- Patent number 9,452,507
- Issue date Sep 27, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad with window
- Patent number 9,446,498
- Issue date Sep 20, 2016
- rohm and Hass Electronic Materials CMP Holdings, Inc.
- Joseph So
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad with clear endpoint detection window
- Patent number 9,333,620
- Issue date May 10, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad with endpoint detection window
- Patent number 9,314,897
- Issue date Apr 19, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing pad with polishing layer and window
- Patent number 9,259,820
- Issue date Feb 16, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing layer formulation with conditioning t...
- Patent number 9,259,821
- Issue date Feb 16, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Soft and conditionable chemical mechanical window polishing pad
- Patent number 9,238,295
- Issue date Jan 19, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Grant
Multilayer chemical mechanical polishing pad stack with soft and co...
- Patent number 9,238,296
- Issue date Jan 19, 2016
- Rohm and Haas Electronic Materials CMP Holdings, Inc.
- James Murnane
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
CMP POLISHING PAD
- Publication number 20250025983
- Publication date Jan 23, 2025
- DuPont Electronic Materials Holding, Inc.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CMP POLISHING PAD
- Publication number 20240091901
- Publication date Mar 21, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
Chemical Mechanical Planarization Pad Having Polishing Layer with M...
- Publication number 20240009798
- Publication date Jan 11, 2024
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PADS FOR IMPROVED REMOVAL RATE AND PL...
- Publication number 20230294240
- Publication date Sep 21, 2023
- Jonathan G. Weis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD AND PREPARATION THEREOF
- Publication number 20230112598
- Publication date Apr 13, 2023
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD AND PREPARATION THEREOF
- Publication number 20230112228
- Publication date Apr 13, 2023
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian QIAN
- B24 - GRINDING POLISHING
Information Patent Application
CMP POLISHING PAD
- Publication number 20230015668
- Publication date Jan 19, 2023
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20220266416
- Publication date Aug 25, 2022
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20190308294
- Publication date Oct 10, 2019
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
HIGH REMOVAL RATE CHEMICAL MECHANICAL POLISHING PADS FROM AMINE INI...
- Publication number 20190168356
- Publication date Jun 6, 2019
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20180361531
- Publication date Dec 20, 2018
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING PADS HAVING OFFSET CIRCUMFERENTIAL GR...
- Publication number 20180354094
- Publication date Dec 13, 2018
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PADS FOR IMPROVED REMOVAL RATE AND PL...
- Publication number 20180345448
- Publication date Dec 6, 2018
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Jonathan G. Weis
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PADS FOR IMPROVED REMOVAL RATE AND PL...
- Publication number 20180345449
- Publication date Dec 6, 2018
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Jonathan G. Weis
- B24 - GRINDING POLISHING
Information Patent Application
METHODS OF MAKING CHEMICAL MECHANICAL POLISHING LAYERS HAVING IMPRO...
- Publication number 20180311792
- Publication date Nov 1, 2018
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20180281149
- Publication date Oct 4, 2018
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH REMOVAL RATE CHEMICAL MECHANICAL POLISHING PADS AND METHODS OF...
- Publication number 20170361421
- Publication date Dec 21, 2017
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Thomas P. Willumstad
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD AND METHOD OF MAKING SAME
- Publication number 20160379840
- Publication date Dec 29, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD AND METHOD OF MAKING SAME
- Publication number 20160375543
- Publication date Dec 29, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- G02 - OPTICS
Information Patent Application
METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20160375553
- Publication date Dec 29, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- David Michael Veneziale
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL...
- Publication number 20160375552
- Publication date Dec 29, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING PAD COMPOSITE POLISHING LAYER FORMULA...
- Publication number 20160375545
- Publication date Dec 29, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL...
- Publication number 20160375554
- Publication date Dec 29, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20160375555
- Publication date Dec 29, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- David Michael Veneziale
- B24 - GRINDING POLISHING
Information Patent Application
COMPOSITE POLISHING LAYER CHEMICAL MECHANICAL POLISHING PAD
- Publication number 20160375544
- Publication date Dec 29, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Julia Kozhukh
- G02 - OPTICS
Information Patent Application
POLISHING PAD WINDOW
- Publication number 20160279757
- Publication date Sep 29, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL PLISHING PAD WITH WINDOW
- Publication number 20160263721
- Publication date Sep 15, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Joseph So
- B24 - GRINDING POLISHING
Information Patent Application
HIGH-STABILITY POLYURETHANE POLISHING PAD
- Publication number 20160176012
- Publication date Jun 23, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CONTROLLED-VISCOSITY CMP CASTING METHOD
- Publication number 20160176022
- Publication date Jun 23, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- B24 - GRINDING POLISHING
Information Patent Application
CONTROLLED-EXPANSION CMP PAD CASTING METHOD
- Publication number 20160176013
- Publication date Jun 23, 2016
- Rohm and Haas Electronic Materials CMP Holdings, INC.
- Bainian Qian
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Bainian Qian

Person

Patents Grantslast 30 patents

Chemical mechanical polishing pad and preparation thereof

Chemical mechanical polishing pad and preparation thereof

Methods of making chemical mechanical polishing layers having impro...

Chemical mechanical polishing pad

Chemical mechanical polishing pad

High removal rate chemical mechanical polishing pads and methods of...

Chemical mechanical polishing pads having offset circumferential gr...

High removal rate chemical mechanical polishing pads from amine ini...

Chemical mechanical polishing pads for improved removal rate and pl...

Method of making polishing layer for chemical mechanical polishing pad

Method of making polishing layer for chemical mechanical polishing pad

Method of making composite polishing layer for chemical mechanical...

Method of making composite polishing layer for chemical mechanical...

Chemical mechanical polishing pad and method of making same

Chemical mechanical polishing pad composite polishing layer formula...

Chemical mechanical polishing pad and method of making same

Controlled-expansion CMP PAD casting method

Composite polishing layer chemical mechanical polishing pad

High-stability polyurethane polishing pad

Chemical mechanical polishing method

Polishing pad window

Chemical mechanical polishing pad with composite polishing layer

Controlled-viscosity CMP casting method

Chemical mechanical polishing pad with window

Chemical mechanical polishing pad with clear endpoint detection window

Chemical mechanical polishing pad with endpoint detection window

Chemical mechanical polishing pad with polishing layer and window

Chemical mechanical polishing layer formulation with conditioning t...

Soft and conditionable chemical mechanical window polishing pad

Multilayer chemical mechanical polishing pad stack with soft and co...

Patents Applicationslast 30 patents

CMP POLISHING PAD

CMP POLISHING PAD

Chemical Mechanical Planarization Pad Having Polishing Layer with M...

CHEMICAL MECHANICAL POLISHING PADS FOR IMPROVED REMOVAL RATE AND PL...

CHEMICAL MECHANICAL POLISHING PAD AND PREPARATION THEREOF

CHEMICAL MECHANICAL POLISHING PAD AND PREPARATION THEREOF

CMP POLISHING PAD

CHEMICAL MECHANICAL POLISHING PAD

CHEMICAL MECHANICAL POLISHING PAD

HIGH REMOVAL RATE CHEMICAL MECHANICAL POLISHING PADS FROM AMINE INI...

CHEMICAL MECHANICAL POLISHING PAD

CHEMICAL MECHANICAL POLISHING PADS HAVING OFFSET CIRCUMFERENTIAL GR...

CHEMICAL MECHANICAL POLISHING PADS FOR IMPROVED REMOVAL RATE AND PL...

CHEMICAL MECHANICAL POLISHING PADS FOR IMPROVED REMOVAL RATE AND PL...

METHODS OF MAKING CHEMICAL MECHANICAL POLISHING LAYERS HAVING IMPRO...

CHEMICAL MECHANICAL POLISHING PAD

HIGH REMOVAL RATE CHEMICAL MECHANICAL POLISHING PADS AND METHODS OF...

CHEMICAL MECHANICAL POLISHING PAD AND METHOD OF MAKING SAME

CHEMICAL MECHANICAL POLISHING PAD AND METHOD OF MAKING SAME

METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD

METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL...

CHEMICAL MECHANICAL POLISHING PAD COMPOSITE POLISHING LAYER FORMULA...

METHOD OF MAKING COMPOSITE POLISHING LAYER FOR CHEMICAL MECHANICAL...

METHOD OF MAKING POLISHING LAYER FOR CHEMICAL MECHANICAL POLISHING PAD

COMPOSITE POLISHING LAYER CHEMICAL MECHANICAL POLISHING PAD

POLISHING PAD WINDOW

CHEMICAL MECHANICAL PLISHING PAD WITH WINDOW

HIGH-STABILITY POLYURETHANE POLISHING PAD

CONTROLLED-VISCOSITY CMP CASTING METHOD

CONTROLLED-EXPANSION CMP PAD CASTING METHOD