Balaji Nandhivaram Muthuraman

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Reutlingen, DE

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Patents Applicationslast 30 patents

Information Patent Application
Package Redistribution Layer Structures for Stress Mitigation and A...
- Publication number 20240395686
- Publication date Nov 28, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectively Dispensed Underfill and Edge Bond Patterns
- Publication number 20240249989
- Publication date Jul 25, 2024
- Apple Inc.
- Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS