Balaram Ghosal

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 8,026,613
- Issue date Sep 27, 2011
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 7,923,849
- Issue date Apr 12, 2011
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnections for flip-chip using lead-free solders and having r...
- Patent number 7,410,833
- Issue date Aug 12, 2008
- International Business Machines Corporation
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transfer join process and multilevel thin film module
- Patent number 6,998,327
- Issue date Feb 14, 2006
- International Business Machines Corporation
- Jeffrey B. Danielson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Socketable bump grid array shaped-solder on copper spheres
- Patent number 6,070,782
- Issue date Jun 6, 2000
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socketable bump grid array shaped-solder on copper spheres
- Patent number 5,868,304
- Issue date Feb 9, 1999
- International Business Machines Corporation
- Peter Jeffrey Brofman
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of joining an electrical contact element to a substrate
- Patent number 5,670,418
- Issue date Sep 23, 1997
- International Business Machines Corporation
- Balaram Ghosal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively coated member having a shank with a portion masked
- Patent number 5,448,016
- Issue date Sep 5, 1995
- International Business Machines Corporation
- Nunzio DiPaolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for selectively coating a member having a shank by masking a...
- Patent number 5,397,598
- Issue date Mar 14, 1995
- International Business Machines Corporation
- Nunzio DiPaolo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20120012642
- Publication date Jan 19, 2012
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080206979
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080203585
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...
- Publication number 20080202792
- Publication date Aug 28, 2008
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnections for flip-chip using lead-free solders and having r...
- Publication number 20050224966
- Publication date Oct 13, 2005
- Keith E. Fogel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin film transfer join process and multilevel thin film module
- Publication number 20040097078
- Publication date May 20, 2004
- International Business Machines Corporation
- Jeffrey B. Danielson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Balaram Ghosal

Person

Patents Grantslast 30 patents

Interconnections for flip-chip using lead-free solders and having r...

Interconnections for flip-chip using lead-free solders and having r...

Interconnections for flip-chip using lead-free solders and having r...

Thin film transfer join process and multilevel thin film module

Socketable bump grid array shaped-solder on copper spheres

Socketable bump grid array shaped-solder on copper spheres

Method of joining an electrical contact element to a substrate

Selectively coated member having a shank with a portion masked

Method for selectively coating a member having a shank by masking a...

Patents Applicationslast 30 patents

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING R...

Interconnections for flip-chip using lead-free solders and having r...

Thin film transfer join process and multilevel thin film module