Balehithlu Manjappaiah Upendra

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and lead frame with enhanced device isolation
- Patent number 12,211,770
- Issue date Jan 28, 2025
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-molded lead frames for semiconductor packages
- Patent number 11,699,647
- Issue date Jul 11, 2023
- Infineon Technologies AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-clip structure for die bonding
- Patent number 11,189,592
- Issue date Nov 30, 2021
- Infineon Technologies Austria AG
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20230307328
- Publication date Sep 28, 2023
- INFINEON TECHNOLOGIES AG
- Balehithlu Manjappaiah UPENDRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND LEAD FRAME WITH ENHANCED DEVICE ISOLATION
- Publication number 20230088833
- Publication date Mar 23, 2023
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-MOLDED LEAD FRAMES FOR SEMICONDUCTOR PACKAGES
- Publication number 20220336340
- Publication date Oct 20, 2022
- INFINEON TECHNOLOGIES AG
- Balehithlu Manjappaiah UPENDRA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Clip Structure for Die Bonding
- Publication number 20200105707
- Publication date Apr 2, 2020
- Balehithlu Manjappaiah Upendra
- H01 - BASIC ELECTRIC ELEMENTS