Bang Ning Hsu

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Taichung, TW

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Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED NANOPARTICLES FOR ON-DIE THERMAL ENHANCEMENT OF HYBRID BON...
- Publication number 20240071987
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE STACKS AND ASSOCIATED SYSTEMS AND METHODS
- Publication number 20240071969
- Publication date Feb 29, 2024
- Micron Technology, Inc.
- Kyle K. Kirby
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PERPENDICULAR SEMICONDUCTOR DEVICE ASSEMBLIES AND ASSOCIATED METHODS
- Publication number 20240063184
- Publication date Feb 22, 2024
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-DIE TEMPERATURE CONTROL FOR SEMICONDUCTOR DIE ASSEMBLIES AND ASS...
- Publication number 20230060671
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR DIRECT BONDING IN SEMICONDUCTOR DIE MANUFAC...
- Publication number 20230066395
- Publication date Mar 2, 2023
- Micron Technology, Inc.
- Bang-Ning Hsu
- H01 - BASIC ELECTRIC ELEMENTS