Bangtao Chen

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and method of acoustic device
- Patent number 11,799,440
- Issue date Oct 24, 2023
- Wuhan MEMSonics Technologies Co., Ltd.
- Zhipeng Ding
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Layer arrangement and a wafer level package comprising the layer ar...
- Patent number 9,240,362
- Issue date Jan 19, 2016
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
Packaging Structure and Method of Acoustic Device
- Publication number 20230308073
- Publication date Sep 28, 2023
- Wuhan MEMSonics Technologies Co.,Ltd.
- Zhipeng DING
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Film Bulk Acoustic Resonator and Manufacturing Method therefor, and...
- Publication number 20230091745
- Publication date Mar 23, 2023
- Wuhan MEMSonics Technologies Co.,Ltd.
- Bangtao CHEN
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER AR...
- Publication number 20150130039
- Publication date May 14, 2015
- Agency for Science, Technology and Research
- Vivek Chidambaram
- B81 - MICRO-STRUCTURAL TECHNOLOGY