Bao Xusheng

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for forming a low profile embedded...
- Patent number 10,622,293
- Issue date Apr 14, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of stacking semiconductor die on a...
- Patent number 9,478,485
- Issue date Oct 25, 2016
- STATS ChipPAC Pte. Ltd.
- XuSheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer around...
- Patent number 9,437,552
- Issue date Sep 6, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,401,331
- Issue date Jul 26, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a low profile embedded...
- Patent number 9,293,401
- Issue date Mar 22, 2016
- STATS ChipPAC, Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EWLB semiconductor packa...
- Patent number 9,252,172
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with a substrate embedded dummy...
- Patent number 9,236,278
- Issue date Jan 12, 2016
- Stats Chippac Ltd.
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming openings through encapsu...
- Patent number 9,171,769
- Issue date Oct 27, 2015
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL under bump for elect...
- Patent number 9,142,522
- Issue date Sep 22, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 8,963,326
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer around...
- Patent number 8,878,359
- Issue date Nov 4, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a vertical interconnect structure for 3-D...
- Patent number 8,796,846
- Issue date Aug 5, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with warpage control and method...
- Patent number 8,766,426
- Issue date Jul 1, 2014
- Stats Chippac Ltd.
- Hin Hwa Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit system with test pads and method of manufacture...
- Patent number 8,614,508
- Issue date Dec 24, 2013
- Stats Chippac Ltd.
- Bao Xusheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with warpage control and method...
- Patent number 8,455,991
- Issue date Jun 4, 2013
- Stats Chippac Ltd.
- Yung Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with active surface heat remova...
- Patent number 8,421,212
- Issue date Apr 16, 2013
- Stats Chippac Ltd.
- Kang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming insulating layer around...
- Patent number 8,409,926
- Issue date Apr 2, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure i...
- Patent number 8,129,845
- Issue date Mar 6, 2012
- STATS ChipPAC, Ltd.
- TaeHoan Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming enhanced UBM structure f...
- Patent number 7,989,356
- Issue date Aug 2, 2011
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 7,642,128
- Issue date Jan 5, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method for Forming a Low Profile Embedded...
- Publication number 20160141238
- Publication date May 19, 2016
- STATS ChipPAC, Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20150091165
- Publication date Apr 2, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Stacking Semiconductor Die on a...
- Publication number 20150001709
- Publication date Jan 1, 2015
- STATS ChipPAC, Ltd.
- XuSheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Around...
- Publication number 20140339683
- Publication date Nov 20, 2014
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20140239495
- Publication date Aug 28, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Around...
- Publication number 20130147019
- Publication date Jun 13, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL Under Bump for Elect...
- Publication number 20130134580
- Publication date May 30, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A SUBSTRATE EMBEDDED DUMMY...
- Publication number 20130075922
- Publication date Mar 28, 2013
- Rui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SYSTEM WITH TEST PADS AND METHOD OF MANUFACTURE...
- Publication number 20130069063
- Publication date Mar 21, 2013
- Bao Xusheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EWLB Semiconductor Packa...
- Publication number 20120306038
- Publication date Dec 6, 2012
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Openings Through Encapsu...
- Publication number 20120139120
- Publication date Jun 7, 2012
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...
- Publication number 20120074588
- Publication date Mar 29, 2012
- Yung Kuan Hsiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...
- Publication number 20120074560
- Publication date Mar 29, 2012
- Hin Hwa Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVA...
- Publication number 20120068328
- Publication date Mar 22, 2012
- Kang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Insulating Layer Around...
- Publication number 20110221041
- Publication date Sep 15, 2011
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Enhanced UBM Structure f...
- Publication number 20100244239
- Publication date Sep 30, 2010
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20100148360
- Publication date Jun 17, 2010
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure i...
- Publication number 20090079069
- Publication date Mar 26, 2009
- STATS ChipPAC, Ltd.
- TaeHoan Jang
- H01 - BASIC ELECTRIC ELEMENTS

Bao Xusheng

Person

Patents Grantslast 30 patents

Semiconductor device and method for forming a low profile embedded...

Semiconductor device and method of stacking semiconductor die on a...

Semiconductor device and method of forming insulating layer around...

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device and method of forming patterned repassivation...

Semiconductor device and method for forming a low profile embedded...

Semiconductor device and method of forming EWLB semiconductor packa...

Integrated circuit packaging system with a substrate embedded dummy...

Semiconductor device and method of forming openings through encapsu...

Semiconductor device and method of forming RDL under bump for elect...

Semiconductor device and method of forming patterned repassivation...

Semiconductor device and method of forming insulating layer around...

Semiconductor device with a vertical interconnect structure for 3-D...

Integrated circuit packaging system with warpage control and method...

Integrated circuit system with test pads and method of manufacture...

Integrated circuit packaging system with warpage control and method...

Integrated circuit packaging system with active surface heat remova...

Semiconductor device and method of forming insulating layer around...

Semiconductor device and method of forming interconnect structure i...

Semiconductor device and method of forming enhanced UBM structure f...

Semiconductor device and method of forming a vertical interconnect...

Patents Applicationslast 30 patents

Semiconductor Device and Method for Forming a Low Profile Embedded...

Semiconductor Device and Method of Forming Patterned Repassivation...

Semiconductor Device and Method of Stacking Semiconductor Die on a...

Semiconductor Device and Method of Forming Insulating Layer Around...

Semiconductor Device and Method of Forming a Vertical Interconnect...

Semiconductor Device and Method of Forming Insulating Layer Around...

Semiconductor Device and Method of Forming Patterned Repassivation...

Semiconductor Device and Method of Forming RDL Under Bump for Elect...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A SUBSTRATE EMBEDDED DUMMY...

INTEGRATED CIRCUIT SYSTEM WITH TEST PADS AND METHOD OF MANUFACTURE...

Semiconductor Device and Method of Forming EWLB Semiconductor Packa...

Semiconductor Device and Method of Forming Openings Through Encapsu...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH WARPAGE CONTROL AND METHOD...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ACTIVE SURFACE HEAT REMOVA...

Semiconductor Device and Method of Forming Insulating Layer Around...

Semiconductor Device and Method of Forming Enhanced UBM Structure f...

Semiconductor Device and Method of Forming a Vertical Interconnect...

Semiconductor Device and Method of Forming Interconnect Structure i...