Bao ZHU

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Three-dimensional integrated system of RFID chip and super capacito...
- Patent number 12,159,179
- Issue date Dec 3, 2024
- Fudan University
- Bao Zhu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Through silicon via structure for three-dimensional integrated circ...
- Patent number 11,887,912
- Issue date Jan 30, 2024
- Fudan University
- Bao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI active transfer board for three-dimensional packaging and prepa...
- Patent number 11,881,442
- Issue date Jan 23, 2024
- Shanghai Integrated Circuit Manufacturing Innovation Center Co., Ltd.
- Bao Zhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated system of dram chip and preparation me...
- Patent number 11,854,939
- Issue date Dec 26, 2023
- Fudan University
- Bao Zhu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH SILICON VIA STRUCTURE FOR THREE-DIMENSIONAL INTEGRATED CIRC...
- Publication number 20230099959
- Publication date Mar 30, 2023
- Fudan University
- Bao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED SYSTEM OF RFID CHIP AND SUPER CAPACITO...
- Publication number 20230095639
- Publication date Mar 30, 2023
- Fudan University
- Bao ZHU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL INTEGRATED SYSTEM OF DRAM CHIP AND PREPARATION ME...
- Publication number 20230098556
- Publication date Mar 30, 2023
- Fudan University
- Bao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI ACTIVE TRANSFER BOARD FOR THREE-DIMENSIONAL PACKAGING AND PREPA...
- Publication number 20230097450
- Publication date Mar 30, 2023
- Fudan University
- Bao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230049704
- Publication date Feb 16, 2023
- SHANGHAI INTEGRATED CIRCUIT MANUFACTURING INNOVATION CENTER CO., LTD.
- Bao ZHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON-CHIP ALL-SOLID-STATE SUPERCAPACITOR AND PREPARATION METHOD THEREOF
- Publication number 20230021106
- Publication date Jan 19, 2023
- SHANGHAI INTEGRATED CIRCUIT MANUFACTURING INNOVATION CENTER CO., LTD.
- Bao ZHU
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Three-dimensional integrated system of RFID chip and super capacito...

Through silicon via structure for three-dimensional integrated circ...

SOI active transfer board for three-dimensional packaging and prepa...

Three-dimensional integrated system of dram chip and preparation me...

Patents Applicationslast 30 patents

THROUGH SILICON VIA STRUCTURE FOR THREE-DIMENSIONAL INTEGRATED CIRC...

THREE-DIMENSIONAL INTEGRATED SYSTEM OF RFID CHIP AND SUPER CAPACITO...

THREE-DIMENSIONAL INTEGRATED SYSTEM OF DRAM CHIP AND PREPARATION ME...

SOI ACTIVE TRANSFER BOARD FOR THREE-DIMENSIONAL PACKAGING AND PREPA...

METAL INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

ON-CHIP ALL-SOLID-STATE SUPERCAPACITOR AND PREPARATION METHOD THEREOF