BaoHua Zhang

Person

Wuhan City, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip stacking structures and methods for forming the same
- Patent number 12,166,012
- Issue date Dec 10, 2024
- Yangtze Memory Technologies Co., Ltd.
- Xinru Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of integrated circuit packaging structure
- Patent number 11,476,173
- Issue date Oct 18, 2022
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENHANCED INTERCONNECTION BALL GRID ARRAY DESIGN, SEMICONDUCTOR STRU...
- Publication number 20250029912
- Publication date Jan 23, 2025
- Yangtze Memory Technologies Co., Ltd.
- Shanshan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022850
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20250022851
- Publication date Jan 16, 2025
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND FABRICATION
- Publication number 20240371716
- Publication date Nov 7, 2024
- Yangtze Memory Technologies Co., Ltd.
- Li TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240363460
- Publication date Oct 31, 2024
- Yangtze Memory Technologies Co., Ltd.
- Li TAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MEMORY SYSTEM
- Publication number 20240347406
- Publication date Oct 17, 2024
- Yangtze Memory Technologies Co., Ltd.
- Shanshan ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURES, MANUFACTURING METHODS THEREOF AND ELECTRON...
- Publication number 20240178190
- Publication date May 30, 2024
- Yangtze Memory Technologies Co., Ltd.
- Peng Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME
- Publication number 20220254755
- Publication date Aug 11, 2022
- Yangtze Memory Technologies Co., Ltd.
- Xinru ZENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF INTEGRATED CIRCUIT PACKAGING STRUCTURE
- Publication number 20200335410
- Publication date Oct 22, 2020
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING STRUCTURE AND MANUFACTURING METHOD THE...
- Publication number 20200235023
- Publication date Jul 23, 2020
- Yangtze Memory Technologies Co., Ltd.
- Peng Chen
- H01 - BASIC ELECTRIC ELEMENTS

BaoHua Zhang

Person

Patents Grantslast 30 patents

Flip-chip stacking structures and methods for forming the same

Manufacturing method of integrated circuit packaging structure

Patents Applicationslast 30 patents

ENHANCED INTERCONNECTION BALL GRID ARRAY DESIGN, SEMICONDUCTOR STRU...

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

CHIP PACKAGE STRUCTURE AND FABRICATION

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MEMORY SYSTEM

CHIP PACKAGE STRUCTURES, MANUFACTURING METHODS THEREOF AND ELECTRON...

FLIP-CHIP STACKING STRUCTURES AND METHODS FOR FORMING THE SAME

MANUFACTURING METHOD OF INTEGRATED CIRCUIT PACKAGING STRUCTURE

INTEGRATED CIRCUIT PACKAGING STRUCTURE AND MANUFACTURING METHOD THE...