BaoShu Xu

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Pu Dong, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaged spiral inductor structures, processes of making same, and...
- Patent number 7,852,189
- Issue date Dec 14, 2010
- Intel Corporation
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing parasitic mutual capacitances
- Patent number 7,535,080
- Issue date May 19, 2009
- Intel Corporation
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
IC package with signal land pads
- Patent number 7,227,247
- Issue date Jun 5, 2007
- Intel Corporation
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DATA SIGNAL INTERCONNECTION WITH REDUCED CROSSTALK
- Publication number 20070155195
- Publication date Jul 5, 2007
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged spiral inductor structures, processes of making same, and...
- Publication number 20070152796
- Publication date Jul 5, 2007
- Jiangqi He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Complementary inductor structures
- Publication number 20070146105
- Publication date Jun 28, 2007
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing parasitic mutual capacitances
- Publication number 20070001260
- Publication date Jan 4, 2007
- Xiang Yin Zeng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC package with signal land pads
- Publication number 20060180905
- Publication date Aug 17, 2006
- Intel Corporation
- Xiang Yin Zeng
- H01 - BASIC ELECTRIC ELEMENTS