Barbara A. Waterhouse

Person

Richmond, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Optimum padset for wire bonding RF technologies with high-Q inductors
- Patent number 7,754,574
- Issue date Jul 13, 2010
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of metal-insulator-metal capacitor simultaneously with al...
- Patent number 7,511,940
- Issue date Mar 31, 2009
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-continuous encapsulation layer for MIM capacitor
- Patent number 7,326,987
- Issue date Feb 5, 2008
- International Business Machines Corporation
- Wagdi Abadeer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of metal-insulator-metal capacitor simultaneously with al...
- Patent number 7,301,752
- Issue date Nov 27, 2007
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost bonding pad and method of fabricating same
- Patent number 7,245,025
- Issue date Jul 17, 2007
- International Business Machines Corporation
- Jeffrey Alan Brigante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optimum padset for wire bonding RF technologies with high-Q inductors
- Patent number 7,170,181
- Issue date Jan 30, 2007
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad
- Patent number 7,056,820
- Issue date Jun 6, 2006
- International Business Machines Corporation
- Stephen P. Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-Continuous encapsulation layer for MIM capacitor
- Patent number 6,913,965
- Issue date Jul 5, 2005
- International Busniess Machines Corporation
- Wagdi W. Abadeer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTIMUM PADSET FOR WIRE BONDING RF TECHNOLOGIES WITH HIGH-Q INDUCTORS
- Publication number 20080132026
- Publication date Jun 5, 2008
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF METAL-INSULATOR-METAL CAPACITOR SIMULTANEOUSLY WITH AL...
- Publication number 20080019077
- Publication date Jan 24, 2008
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST BONDING PAD AND METHOD OF FABRICATING SAME
- Publication number 20070120216
- Publication date May 31, 2007
- International Business Machines Corporation
- Jeffrey Alan Brigante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF METAL-INSULATOR-METAL CAPACITOR SIMULTANEOUSLY WITH AL...
- Publication number 20050272219
- Publication date Dec 8, 2005
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONTINUOUS ENCAPSULATION LAYER FOR MIM CAPACITOR
- Publication number 20050189615
- Publication date Sep 1, 2005
- International Business Machines Corporation
- Wagdi W. Abadeer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMPROVED BOND PAD
- Publication number 20050112794
- Publication date May 26, 2005
- International Business Machines Corporation
- Stephen P. Cole
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTIMUM PADSET FOR WIRE BONDING RF TECHNOLOGIES WITH HIGH-Q INDUCTORS
- Publication number 20050104188
- Publication date May 19, 2005
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-CONTINUOUS ENCAPSULATION LAYER FOR MIM CAPACITOR
- Publication number 20040251514
- Publication date Dec 16, 2004
- INTRENATIONAL BUSINESS MACHINES CORPORATION
- Wagdi William Abadeer
- H01 - BASIC ELECTRIC ELEMENTS

Barbara A. Waterhouse

Person

Patents Grantslast 30 patents

Optimum padset for wire bonding RF technologies with high-Q inductors

Formation of metal-insulator-metal capacitor simultaneously with al...

Non-continuous encapsulation layer for MIM capacitor

Formation of metal-insulator-metal capacitor simultaneously with al...

Low cost bonding pad and method of fabricating same

Optimum padset for wire bonding RF technologies with high-Q inductors

Bond pad

Non-Continuous encapsulation layer for MIM capacitor

Patents Applicationslast 30 patents

OPTIMUM PADSET FOR WIRE BONDING RF TECHNOLOGIES WITH HIGH-Q INDUCTORS

FORMATION OF METAL-INSULATOR-METAL CAPACITOR SIMULTANEOUSLY WITH AL...

LOW COST BONDING PAD AND METHOD OF FABRICATING SAME

FORMATION OF METAL-INSULATOR-METAL CAPACITOR SIMULTANEOUSLY WITH AL...

NON-CONTINUOUS ENCAPSULATION LAYER FOR MIM CAPACITOR

IMPROVED BOND PAD

OPTIMUM PADSET FOR WIRE BONDING RF TECHNOLOGIES WITH HIGH-Q INDUCTORS

NON-CONTINUOUS ENCAPSULATION LAYER FOR MIM CAPACITOR