Barbara Lorenz

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method for filling trench and relief geometries in semiconductor st...
- Patent number 7,265,025
- Issue date Sep 4, 2007
- Infineon Technologies AG
- Dietmar Temmler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an isolation layer and method of manufacturing a...
- Patent number 6,984,556
- Issue date Jan 10, 2006
- Infineon Technologies AG
- Christian Drabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor structure
- Patent number 6,245,640
- Issue date Jun 12, 2001
- Siemens Aktiengesellschaft
- Wilhelm Claussen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for etching a trench in a semiconductor substrate
- Publication number 20060264054
- Publication date Nov 23, 2006
- Martin Ulrich Gutsche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for filling trench and relief geometries in semiconductor st...
- Publication number 20050148171
- Publication date Jul 7, 2005
- Dietmar Temmler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming an isolation layer and method of manufacturing a...
- Publication number 20040198015
- Publication date Oct 7, 2004
- Christian Drabe
- H01 - BASIC ELECTRIC ELEMENTS